A wiring substrate device includes a wiring substrate, a plurality of terminals each of which is provided upright on the wiring substrate and has a lower end, an upper end and a narrowed part between the lower end and the upper end, and a plurality of solders each of which has a melting point lower than the terminals and covers a surface of the corresponding terminal.

A display device includes a bracket, a display panel, a first force sensor, and a main circuit board. The display panel is disposed on the bracket. The first force sensor is disposed between the display panel and the bracket, the first force sensor being adjacent to a first edge of the display panel. The main circuit board is disposed below the bracket such that the bracket is disposed between the display panel and the main circuit board. The bracket includes a first hole exposing the main circuit board. The first force sensor is connected to the main circuit board through the first hole.

Provided is an electronic component mounting structure and method for mounting electronic components on the side of a printed circuit board by means of simple fabrication and enlarging the surface area for mounting electronic components. A cut face of a conductive plating layer, which is obtained by cutting along a via in which a conductive plating layer covering an inner wall face of a via hole is electrically connected to a conductive pattern layer of the printed circuit board, is exposed at a cut end face and used as a land pattern which is solder-connected to a mount connecting portion of the electronic component. The end face at which the land pattern is exposed is a surface parallel to the side of the printed circuit board, and therefore electronic components can be mounted on the end face parallel to the side.

A circuit board structure that includes a resin-based conductive adhesive layer is disclosed, in which a conductive layer is arranged between a first circuit board and a second circuit board. The conductive layer includes a first conductive paste layer and the resin-based conductive adhesive layer is formed on the first conductive paste layer. The resin-based conductive adhesive layer contains a sticky resin material and a plurality of conductive particles distributed in the sticky resin material. The plurality of conductive particles establish an electrical connection between the first conductive paste layer and the resin-based conductive adhesive layer.

An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof.

An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof. Each PCB panel comprises discrete, PCB radial segments that are mechanically and electrically coupled together to form the respective PCB panels.

An axial field rotary energy device with a PCB stator having interleaved PCBs is disclosed. The device can include rotors that have magnets and an axis of rotation. A stator assembly can be located axially between the rotors to operate electrical phases. The stator assembly can include PCB panels. Each PCB panel can have layers, and each PCB panel can be designated to one of the electrical phases. Each electrical phase of the stator assembly can be provided by a plurality of the PCB panels. In addition, the PCB panels for each electrical phase can be axially spaced apart from and intermingled with each other.

An axial field rotary energy device can include rotors having magnets and an axis of rotation. A stator assembly can be located axially between the rotors. The stator assembly can include PCB panels. Each PCB panel can have layers. Each layer can include coils. Each coil can have radial traces relative to the axis. The radial traces can include non-linear radial traces coupled by arch traces that are transverse to the non-linear radial traces.

A glass circuit board includes, on a glass substrate, a stress relief layer, a seed layer, and an electroplated layer including copper plating. The stress relief layer is an insulator formed by dry coating method and applies a compressive residual stress to the glass substrate at room temperature. The stress relief layer thus reduces cracking, fracturing or warpage of the glass substrate caused by thermal expansion and shrinkage of the copper plating due to heating and cooling of the glass circuit board during manufacturing or thermal cycling, ensuring high connection reliability of the glass circuit board.

A die package is disclosed through which power domains within the chip may be isolated by removing vias within the package substrate, rather than power gating. Multiple substrate options may be configured without specific vias. This eliminates the need to design power gating circuitry into the die, freeing up that die area for more functional logic. The solution allows the die package to retain the same pinout for use by PCB designers, regardless of which power domains are gated.