Patent classifications
H05K2201/09836
Systems and methods of fabricating coils for coreless transformers and inductors
The disclosure relates to systems and methods for fabricating printed circuit board (PCB) based transformers and/or coreless PCB-based circuits containing one or more coil inductor(s). More specifically, the disclosure is directed to systems and methods for fabricating PCB-based transformers and/or inductors having concentric or eccentric (non-concentric) continuous or concatenated coil architecture.
VGA monitor emulating printed circuit board
A printed circuit board comprises a substrate as well as resistors and electrical connections disposed on the substrate. The substrate couples to a video graphics array connector that has pins, including video pins and return pins. A video pin transmits a video signal, and a return pin provides a ground for a corresponding video pin. The substrate has openings, where each opening can receive a pin. The resistors and the electrical connections couple to a subset of the pins to mimic an external video graphics array monitor. The resistors comprise: a red connection resistor that can couple a red video pin with a red return pin; a green connection resistor that can couple a green video pin with a green return pin; and a blue connection resistor that can couple a blue video pin with a blue return pin.
X-CROSS NON-CIRCULAR MICRO VIAS FOR LAYER INTERCONNECT IN PRINTED WIRING BOARD
A printed circuit board (PCB) may include a first layer including a first plurality of conductive pads spaced apart from each other, a second layer including a second plurality of conductive pads spaced apart from each other, a first plurality of non-circular shaped micro vias connecting between the first plurality of conductive pads of the first layer and the second plurality of conductive pads of the second layer, a third layer including a third plurality of conductive pads spaced apart from each other, and a second plurality of non-circular shaped micro vias connecting between the second plurality of conductive pads of the second layer and the third plurality of conductive pads of the third layer. The second plurality of non-circular shaped micro vias may be rotated at an angle from the first plurality of non-circular shaped micro vias to form an offset pattern along an X-Y plane.