An electroplating method of a circuit board includes: providing a multi-layer board having a conductive layer embedded therein; penetratingly forming a thru-hole and at least one penetrating hole in the multi-layer board, and forming a conductive portion on an inner wall defining the thru-hole and connected to the conductive layer, wherein the at least one penetrating hole is located at one side of the thru-hole, and an annular portion of the conductive layer exposed from the at least one penetrating hole is defined as an electroplated region; and electroplating the electroplated region to be formed with a metal post by applying a current to the conductive portion, wherein the metal post is filled in the at least one penetrating hole and is connected to the electroplated region.

A display device includes: a substrate having a first surface, a second surface opposite to the first surface, and an inner side surface defining through holes; a first wiring and a second wiring disposed on the first surface; and a first conductor and a second conductor disposed in one of the through holes. The first conductor is connected to the first wiring, the second conductor is connected to the second wiring, and the first and second conductors are insulated from each other.

A circuit module includes a substrate on which a first electrode and a second electrode are provided, a first electronic component, and a first resin layer. The first electrode includes a first electrode base body and a first plating film. The second electrode and the first electronic component are covered with the first resin layer. The second electrode includes a second electrode base body, a metal column, whose one end is directly connected to the second electrode base body and another end is positioned in an inner side relative to an outer surface of the first resin layer, a second plating film with a cylindrical shape covering a side surface of a connection body of the second electrode base body and the metal column, and a covering portion connected to the other end of the metal column.

A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

A photoresist is deposited on a seed layer on a substrate. A first region of the photoresist is removed to expose a first portion of the seed layer to form a via-pad structure. A first conductive layer is deposited onto the first portion of the seed layer. A second region of the photoresist adjacent to the first region is removed to expose a second portion of the seed layer to form a line. A second conductive layer is deposited onto the first conductive layer and the second portion of the seed layer.

A circuit board includes a substrate and at least two through holes defined in the substrate. The substrate includes a first conductive circuit layer and a second conductive circuit layer. The first conductive circuit layer and the second conductive circuit layer are respectively formed on opposite surfaces of the substrate. A number of conductive strips are formed on an inner wall of each of the at least two through holes. The number of conductive strips on the inner wall of a first one of the at least two through holes faces the number of conductive strips on the inner wall of a second one of the at least one through hole.

A lighting device including a light-emitter including light emitting elements, and a support having a first surface that carries a wiring line electrically connecting element electrodes of the light emitting elements and a light emitting surface, and a substrate including a base substrate, a conductor formed on a first surface of the base substrate, an adhesive member formed on a second surface of the base substrate, and a through-hole penetrating the substrate. A space is formed between the substrate and the light-emitter to communicate with a bottomed hole formed in a location of the through-hole as a result of adhering an adhesive surface of the adhesive member to a surface of the light-emitter having the wiring line formed thereon. The wiring line is connected to the conductor via a filler filling the bottomed hole, and the space is located outside an opening of the bottomed hole.

A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.

A component carrier includes a stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack, and at least one stress relief opening formed in each of the at least one electrically conductive layer structure arranged in the stack on one side of the component so that a portion of the stack extending from an exterior main surface of the component carrier up to a main surface of the component on said side and including the at least one stress relief opening is free of electrically conductive material.