A display device includes a driving substrate, a front panel laminate, a circuit board, a front protective layer, and a glue. The front panel laminate is disposed on the driving substrate and includes a display medium layer. The circuit board is disposed on an end of the driving substrate. The front protective layer is disposed on the front panel laminate. The front protective layer has a notch. An end of the circuit board is in the notch. The end of the circuit board and the front protective layer have a first gap therebetween. The glue is filled in the first gap. A normal projection of the glue on the driving substrate overlaps a normal projection of the circuit board on the driving substrate and overlaps a normal projection of the front protective layer on the driving substrate.

A wireless communication device is provided and includes a communication module, a dust and moisture resistant adhesive, and a nano-metallic layer. The communication module includes a circuit board, a communication chip and a plurality of passive components mounted on a carrying surface of the circuit board, and an insulating sheet that is disposed on the passive components and that has a thickness smaller than or equal to 150 μm. The dust and moisture resistant adhesive covers any electrically conductive portions of the communication module on the carrying surface. The nano-metallic layer covers the dust and moisture resistant adhesive, the communication chip, the passive components, and the insulating sheet, and is electrically coupled to a grounding portion of the circuit board. The wireless communication device does not include any grounding metal housing mounted on the circuit board.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

A coaxial thru-via conductor and a method of fabricating the coaxial thru-via conductor can provide enhanced operations for semiconductor devices mounted on a substrate.

A coaxial thru-via conductor and a method of fabricating the coaxial thru-via conductor can provide enhanced operations for semiconductor devices mounted on a substrate.

Described herein are wireless billiard ball devices comprising a spherical housing and a circuit board mounted within the spherical housing, the circuit board having components for measuring the impact location of a billiard cue strike upon the surface of the spherical housing in reference to the relative orientation of the device with respect to gravity. The devices described herein do not require manual alignment by a player to measure impact location data. In other embodiments, the spherical housing is comprised of a bored hole, a potting material, and a circuit board mounted within the bored hole and secured in place with the potting material, the circuit board having components for measuring the impact location of a billiard cue strike upon the surface of the spherical housing in reference to the relative orientation of the device with respect to gravity.

Surgical devices include adapter assemblies which electrically and mechanically interconnect handles of electromechanical surgical devices to surgical loading units. Electrical components of the surgical devices are coated with a multi-layer conformal coating which permits the devices to be sterilized in an autoclave without damaging the electrical components.

A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.

A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.

The present disclosure includes a method for producing a printed circuit board having at least one coating includes mixing a first component with a second component of a two component coating system to form a coating mixture by means of a dynamic mixer or by means of a static-dynamic mixer. The method also includes supplying the coating mixture to an output unit, and coating the printed circuit board by outputting the coating mixture using the output unit onto the printed circuit board. The output unit is moved automatically in at least one, two, or three dimensions relative to the printed circuit board. The mixer is connected with the output unit in such a manner that it is moved together with the output unit relative to the printed circuit board. The present disclosure also includes a coating head for performing the method.