An integrated circuit assembly includes a first electrically conductive sheet, a second electrically conductive sheet electrically isolated from the first electrically conductive sheet, a non-conductive material disposed between the first and second electrically conductive sheets, an electrical trace disposed on the non-conductive material and electrically isolated from the first and second electrically conductive sheets, and an integrated circuit having at least one lead directly connected to the first electrically conductive sheet, at least one lead directly connected to the second electrically conductive sheet, and at least one lead electrically connected to the electrical trace. Other integrated circuit assemblies and method for making integrated circuit assemblies are also disclosed.

Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.

A display device and a manufacturing method thereof are provided. The display device includes a display panel, a circuit board, and a conductive adhesive member. The display panel includes a display area and a non-display area adjacent to the display area. The circuit board overlaps the non-display area and is connected to the display panel. The conductive adhesive member is between and electrically connects the circuit board and the display panel. The circuit board includes: a base layer including a pad area; circuit pads overlapping the pad area and on the base layer, the circuit pads being spaced apart in a plan view and arranged in a direction; and a first resin layer overlapping the pad area and on the base layer. In a plan view, the first resin layer overlaps an area between two adjacent circuit pads and covers side surfaces of the two adjacent circuit pads facing in the direction.

To provide a wiring substrate which can prevent short circuit between connection terminals, and which realizes reduction of the pitch between the connection terminals. The wiring substrate of the present invention includes a layered structure including one or more insulation layers and one or more conductor layers, and the wiring substrate is characterized in that a plurality of connection terminals are formed on the layered structure so as to be separated from one another; a filling member is filled between the connection terminals; and each of the connection terminals has a side surface composed of a contact surface which is in contact with the filling member, and a spaced surface which is not in contact with the filling member and which is located above the contact surface and below the top surface of the filling member.

A circuit board according to an embodiment includes an insulating layer; a pad disposed on the insulating layer; and a protective layer disposed on the insulating layer and including a recess portion vertically overlapping with the pad, wherein the protective layer includes a first portion including a first part of the recess portion; and a second portion disposed on the first portion and including a second part of the recess portion connected to the first portion, and wherein a width of the second part of the recess portion is greater than a width of the first part of the recess portion.

This application provides a circuit board, a circuit board assembly, and an electronic device. Specifically, the circuit board includes a circuit board body, a first group of pads, and a second group of pads. The circuit board body includes a first surface. The first group of pads and the second group of pads are disposed on the first surface. The first group of pads is distributed along a first ring, the first group of pads includes first pads, and the first pads are arranged on an edge that is of the first ring and that is close to the second group of pads. The second group of pads is distributed along a second ring, the second group of pads includes second pads, and the second pads are arranged on an edge that is of the second ring and that is close to the first group of pads.