A light source unit includes light sources and a light source substrate. Each of the light sources includes terminals. The light source substrate includes a support layer, a wiring portion, mounting portions, an insulating cover layer, locking edges, and solder portions. The support layer has flexibility and an insulating property. The wiring portion is formed on the support layer. Each of the mounting portions includes lands provided midway in the wiring portion and facing each other at a distance. The mounting portions are assigned to the light sources, respectively. The insulating cover layer is formed on the support layer to cover the wiring portion and includes opening edges. The locking edges are formed by sections of the opening edges to overlap the lands in a non-linear manner in a plan view. The solder portions conform and adhere to the locking edges and electrically connect the lands to the terminals.

An electronic component is mounted on the mounting face of a printed wiring board and a plurality of terminals arranged on the mounting face of the printed wiring board are respectively bonded to a plurality of terminals arranged on the bottom surface of the electronic component by means of solder. Solder paste containing powdery solder and thermosetting resin is provided to the plurality of terminals on the mounting face, then the electronic component is mounted on the mounting face of the printed wiring board, and subsequently the solder paste is heated to bond the corresponding terminals by means of molten solder. Thereafter, the molten solder is allowed to solidify and the thermosetting resin separated from the solder paste is allowed to cure in a state where it is held in contact with metal members arranged separately relative to the terminals.

A wiring board includes: a glass substrate serving as a substrate, which includes a first surface, a second surface which is opposite to the first surface, and a side surface; an input electrode serving an electrode, which is located close to a side of the first surface; an insulating layer disposed on the glass substrate; and a side wiring disposed so as to extend from the input electrode via the side surface to the second surface. An end of the insulating layer located close to the side is provided with a cutaway portion extending in an inward direction of the insulating layer, the input electrode is disposed in an entrance-side part of the cutaway portion, and the cutaway portion includes a bottom-side part constituting an inward area which is free of the input electrode.

A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.

Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.

A circuit board (10, 10, 10) includes at last one insulating substrate layer (SL1, SL2, SL3, SL4, SL5) and a plurality of electrically conductive copper coats (C1, C2, C3) arranged on the at least one insulating substrate layer (SL1, SL2, SL3, SL4, SL5), wherein at least one of the electrically conductive copper coats (C1, C2, C3) is coated at least on both sides with a layer (HSI, HS2, HS3) made of a material for inhibiting electromigration, wherein on a layer (HS1, HS2) made of a material for inhibiting electromigration a further metal layer (M1, M2, M3, M3) is provided, which is in turn coated with a further layer (HS3, HS3) made of a material for inhibiting electromigration.

Embodiments are generally directed to module installation on printed circuit boards with embedded trace technology. An embodiment of a printed circuit board includes one or more layers including a top layer; multiple embedded traces that are contained in an area of a surface of a first layer of the one or more layers of the printed circuit board; and a first module, the first module being installed on the plurality of printed traces in the area.

A semiconductor package assembly is provided. The semiconductor package assembly includes a base, a semiconductor package, and a capacitor. The base has a top surface and a bottom surface. The semiconductor package is disposed on the top surface of the base. The capacitor is disposed on the semiconductor package and located between the semiconductor package and the base. The capacitor has a back surface located away from the semiconductor package. The back surface of the capacitor is higher than the bottom surface of the base and lower than the top surface of the base.

A stretchable board includes: a base material having stretchability; first and second electronic components mounted on the base material; a wire arranged on the base material; and first and second connectors for connecting the first and second electronic components and the wire to each other. At least a portion of the first electronic component and at least a portion of the second electronic component face each other in a planned stretching direction in which the base material includes: a facing zone interposed between the first and second electronic components in a planned stretching direction and a non-facing zone other than the facing zone on the base material, in which at least a portion of the first connector or at least a portion of the second connector are arranged in the non-facing zone, and in which at least one of the wires is arranged in the non-facing zone.

A die and a substrate are provided. The die comprises at least one integrated circuit chip, and the substrate comprises first and second subsets of conductive pillars extending at least partially therethrough. Each of the first subset of conductive pillars comprises a protrusion bump pad protruding from a surface of the substrate, and the second subset of conductive pillars each partially form a trace recessed within the surface of the substrate. The die is coupled to the substrate via a plurality of conductive bumps each extending between one of the protrusion bump pads and the die.