A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.

Disclosed herein is a method. A first electrically conductive trace is provided on a substrate. A second electrically conductive trace is providing on the substrate proximate the first electrically conductive trace. A solder mask is provided at the first and the second electrically conductive traces. A portion of the first electrically conductive trace is free of any portion of the solder mask covering thereon.

A printed wiring board includes a substrate, a contact member arranged in contact with the substrate, and a wear resistant member fixed at least in an area on the substrate that comes in contact with the contact member, the wear resistant member having a wear resistance higher than that of the substrate.

A partially molded substrate and a partial molding apparatus and a method thereof, which cover and mold each of one or more conductors formed on the substrate with the insulator to prevent the sizes of the substrate from being increased due to molding, thereby efficiently preventing high voltage between the conductors on the substrate from being applied, and thereby preventing interference around the conductor.

Provided is a key structure including a base plate having at least one connecting seat and at least one notch adjacent to a lower portion of the connecting seat; a keycap disposed above the base plate in a liftable manner; a thin film circuit assembly disposed on the base plate and located between the base plate and the keycap; and a supporting rod connected to the keycap and the base plate and located between the thin film circuit assembly and the keycap. An accommodating space formed by the notch extends from and communicates with a through hole of the connecting seat. The connecting seat protrudes out from an opening of the thin film circuit assembly. A vertical projection region of the notch on the base plate is located within a vertical projection region of the opening on the base plate. The invention also provides a keyboard module.

A keyboard module including keys, a frame, a bottom plate, and a backlight assembly is provided. The frame has a key region. Top surfaces of the keys are exposed in the key region. The frame includes a column. The bottom plate is disposed under the frame. The bottom plate includes a bending portion. The backlight assembly is disposed under the bottom plate, and sequentially includes a light shielding sheet, a light guide plate, and a reflector. The light shielding sheet has a first opening. The light guide plate has a second opening. A part of the reflector is exposed by the first opening and the second opening. The column passes through the bending portion and is located in the first opening and the second opening. A bottom surface of the column leans against the reflector.

Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit. The second FPCB includes: a first connector disposed on the PCB and electrically connected to the wireless communication circuit; a second connector coupled to a second joint electrically connected to the second antenna module; a third connector coupled to a third joint electrically connected to the third antenna module; and a coupler connecting the first connector, the second connector, and the third connector.

A printed circuit board includes a first insulating layer, an embedded pattern embedded in one surface of the first insulating layer, a pad formed on the one surface of the first insulating layer, and a post, wherein the center of a side surface of the post is in contact with the one surface of the first insulating layer.

Provided is a printed wiring board comprising: a substrate; a conductive layer including a land and a wiring and formed on a surface of the substrate, the wiring having a width smaller than the land and drawn from the land; and an insulating layer formed on the conductive layer. The insulating layer has an opening corresponding to a position of the land, and an edge of the opening runs above the land and above one of edges in a width direction of the wiring.

A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.