This application relates to the field of electronic technologies, and provides a printed circuit board and a manufacturing method thereof, and an electronic device. The printed circuit board has target holes that penetrate through the printed circuit board, and an area that is not provided with the target holes has blocking structures (B) for blocking liquid flow, where the area is on at least one side that is of the printed circuit board and that is connected to the target holes.

An aliphatic polycarbonate resin for forming a partition containing a constituent unit represented by the formula (1): ##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, and R.sup.4 are each independently a hydrogen atom, an alkyl group having one or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; at least one of R.sup.1, R.sup.2, R.sup.3, and R.sup.4 is an alkyl group having two or more carbon atoms, an alkoxyalkyl group having two or more carbon atoms, an aryl group, or an aryloxyalkyl group; and R.sup.1, R.sup.2, R.sup.3, and R.sup.4 may be the same or different; and the aliphatic polycarbonate resin has a contact angle against water of 75° or more. Also disclosed is a partition material including the aliphatic polycarbonate resin, a substrate, a method of producing the substrate, a method for producing a wiring substrate, and a wiring forming method.

A printed circuit board according to various embodiments of the present disclosure can include a first substrate layer, a dielectric layer stacked below the first substrate layer, and a second substrate layer stacked below the dielectric layer. The second substrate layer can include: a power line; a ground part disposed to have an isolated area along the power line; and a ground line which extends from the ground part so as to be disposed in the isolated area, and which separates the isolated area into a first area and a second area so as to generate electromagnetic waves for canceling the electromagnetic waves generated by a current flowing through the power line. Other embodiments are also possible.

Provided is an electronic circuit substrate in which any excess space is not necessary around an electronic component, and position deviation at a time of mounting the electronic component can be prevented with high precision. An electronic circuit substrate 100 includes a printed wiring board 10 and an electronic component 20. The printed wiring board 10 has a first land 11 and a second land 12. The electronic component 20 has a first bond portion 24 which is bonded to the first land 11 with solder, and a second bond portion 25 which is bonded to the second land 12 with solder. The bond area of the first land 11 and the first bond portion 24 is larger than the bond area of the second land 12 and the second bond portion 25. In one direction D1, the position of an outer side edge 24b of the first bond portion 24 is set so as to match the position of the outer side edge 11b of the first land 11.

A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.

A load adaptive device includes a substrate, a first electrode, a second electrode, and a passive element. The substrate is configured with a first conductor and a second conductor, and the surface area of the first conductor and/or the surface area of the second conductor are at least 15 mm.sup.2. The distance between the center of the first conductor and the center of the second conductor is at least 9 mm. The first electrode, the second electrode and the passive element are disposed on the substrate. The first electrode is electrically connected to the first conductor. Two terminals of the passive element are electrically connected to the second conductor and the second electrode, respectively. In addition, a hand-made circuit module includes the load adaptive device and a hand-made loop. A part of the hand-made loop is consisted of a hand-bonded conductive tape.

An electronic device includes a flexible circuit structure. The flexible circuit structure includes a flexible substrate and an insulator. The flexible substrate has a surface on which a plurality of pads are disposed. The insulator is disposed on the flexible substrate and is disposed between two adjacent pads of the plurality of pads.

The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.

A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.

A manufacturing method of a circuit board element including the following steps is provided: placing a circuit substrate on a carrier, wherein the circuit substrate includes an insulating layer and a circuit layer disposed thereon, a protective layer disposed on the circuit layer and having a plurality of openings exposing thereof, and a plurality of solder balls disposed on the protective layer and embedded in the openings; forming a trench penetrating the circuit substrate to expose the carrier; forming a photoresist material layer to cover the circuit substrate and filling the spaces between each of the solder balls and the protective layer and is filling in the trench to cover the carrier; curing a portion of the photoresist material layer filled in the spaces to form a dielectric layer; removing a portion of the photoresist material layer filled in the trench to expose the carrier; and removing the carrier.