Disclosed is an organic light emitting display device including a dam structure disposed in a non-display area of a substrate and an alignment mark disposed outside the dam structure. The alignment mark is not covered by, and does not overlap with, the dam structure, because the alignment mark is disposed outside the dame structure. Thus, a scribing process may be performed smoothly.

A method for mechanically connecting a first electronic component, in particular a circuit board element, to a second electronic component, in particular a second circuit board element, includes arranging and orienting the first electronic component, which includes a first through-opening in a first direction, above the second electronic component in the first direction in such a way that a second through opening in the first direction or a blind hole in the first direction is arranged at least partially below the first through-opening in the first direction. The method further includes introducing a casting compound into the first through-opening and into the second through-opening or into the first through-opening and into the blind hole, and setting the casting compound in order to fix the first electronic component in relation to the second electronic component.

A stretchable circuit substrate includes: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.

A flexible wiring substrate includes a main substrate having flexibility, a main wiring disposed over the main substrate, a second protective sheet covering the main wiring, and an insulating member partially covering the main wiring exposed from the second protective sheet and being thinner in thickness than the second protective sheet.

Disclosed is an electronic device. The electronic device includes: a housing including at least a part of a lateral surface of the electronic device; a printed circuit board (PCB) disposed in the housing; at least one wireless communication circuit disposed on the PCB; a first antenna module including at least one antenna disposed in a first region inside the housing; a second antenna module including at least one antenna disposed in a second region inside the housing; a third antenna module including at least one antenna disposed in a third region inside the housing; a first flexible printed circuit board (FPCB) connecting the first antenna module to the at least one wireless communication circuit; and a second FPCB connecting the second antenna module and the third antenna module to the at least one wireless communication circuit. The second FPCB includes: a first connector disposed on the PCB and electrically connected to the wireless communication circuit; a second connector coupled to a second joint electrically connected to the second antenna module; a third connector coupled to a third joint electrically connected to the third antenna module; and a coupler connecting the first connector, the second connector, and the third connector.

A stretchable wiring board that includes a stretchable substrate having a first main surface with a first region, a second region adjacent the first region, and a third region adjacent the second region; a first stretchable wiring line on the first main surface and extending over the first region; an insulating layer extending over the first region and the second region; and a second stretchable wiring line extending over the first region, the second region, and the third region. At a position in the first region where the total thickness of the first stretchable wiring line, the insulating layer, and the second stretchable wiring line is the largest, the thicknesses of the first stretchable wiring line, the insulating layer, and the second stretchable wiring line satisfy a predetermined relationship with the thickness of the second stretchable wiring line at a boundary between the second region and the third region.

A method for producing an electric circuit in which a contact carrier comprising a first contact area and a second contact area is provided. An insulating body is applied to the circuit carrier and at least partially covers the first contact area and the second contact area. The insulating body comprises cut-outs in regions both contact areas. A flowable electrical conducting medium is introduced into the insulating body.

A component-embedded substrate includes: a buildup layer including an insulating resin layer and a conductor layer; a cavity that is formed in the buildup layer; an electronic component that is mounted on a bottom face of the cavity through an adhesive layer; a pedestal that is disposed on the bottom face of the cavity so as to be opposed to four corners of the electronic component; and a filling resin layer that is filled into the cavity to cover the electronic component and the pedestal.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

Methods, devices, and systems for producing a flexible electronic device that reduces stress and forces on electronic components are provided. In particular, one or more transition layers with intermediate flexibility, or flexural modulus, are positioned between rigid components and flexible outer layers. This gradually reduces the flexural modulus of the flexible electronics device rather than have an interface between a rigid material and a flexible material. Various materials and methods of forming the layers are described. In addition, an encapsulate layer can be cured to varying flexural moduli to gradually reduce the flexural moduli from the rigid component to the flexible outer layers or bulk structure of the flexible electronic device.