The exemplary embodiment of the present disclosure provides a circuit board and a detecting device, the circuit board includes: a substrate; a connector, the connector includes a first side surface and a second side surface opposite to the first side surface, the connector is defined on the substrate with the first side surface is adjacent to an edge of the substrate; a plurality of test points, the test points are defined on the substrate and arranged in a straight line along the second side surface. The detecting is configured to detect the circuit board, the detecting device includes: a fixing table; a detecting probe, the detecting probe is fixed on the fixing table and configured to contract with the test points on the circuit board to transmit a signal.

The present invention provides a portable electronic device, and an image-capturing module thereof and a carrier assembly thereof. The image-capturing module includes a circuit substrate, an image-sensing chip, at least one electronic component, a package structure, and a lens assembly. The circuit substrate has a top surface and a bottom surface. The image-sensing chip is electrically connected to the circuit substrate, and the image-sensing chip has an image-sensing area. The at least one electronic component is disposed on the bottom surface of the circuit substrate and electrically connected to the circuit substrate. The package structure is disposed on the bottom surface of the circuit substrate to cover the at least one electronic component. The lens assembly includes a holder structure disposed on the top surface of the circuit substrate and a lens structure held by the holder structure and corresponding to the image-sensing area.

A method for producing an electronic assembly includes providing a printed circuit board with a first face, a second face facing away from the first face, and a first component arranged on the first face. The method further includes arranging the circuit board such that the second face lies on a reference surface, and applying a sealing material which is substantially not flowable prior to being cured onto the first face. The sealing material surrounds a sub-region of the first face of the circuit board. The method further includes arranging a second component at least partly on the reference surface such that the second component is pressed into the sealing material, electrically connecting the second component to the circuit board via an electric connection line, and applying a covering material onto the circuit board first face sub-region surrounded by the sealing material and onto the first component.

In one example, a flexible circuit board includes a signal line disposed between a first ground and a second ground; a dielectric disposed between the first ground and the signal line and between the second ground and the signal line; and a flatness improvement portion disposed on an upper portion of the second ground.

A housing includes a metal base and a non-conductive member. The metal base has an internal surface and a plurality of gap. The non-conductive member covers at least a portion of the internal surface of the metal base, and the non-conductive member is formed on the bottom of the at least one gap. The metal base is spaced by the gaps to form a plurality of metal sheets and at least one main body. Each gap is completely filled with one dielectric member. The metal sheets and the at least one main body are all bonded with the dielectric member and are electrically isolated with each other.

A semiconductor apparatus comprises: a circuit board; a semiconductor package having a main surface, wherein the semiconductor package is arranged on the circuit board and the main surface faces the circuit board; a radio-frequency line element of the semiconductor package, which radio-frequency line element is arranged on the main surface or inside the semiconductor package, wherein the radio-frequency line element is designed to transmit a signal at a frequency of greater than 10 GHz; and an underfiller material arranged between the circuit board and the semiconductor package, wherein the radio-frequency line element and the underfiller material do not overlap in an orthogonal projection onto the main surface.

The present disclosure provides systems and methods for a package securing system including a top plate, an alignment frame, a gasket, and a back plate. The top plate comprises a thermal conductive member to transfer heat from a central processing unit (CPU) and secure the CPU to a ball grid array (BGA) socket and a printed circuit board (PCB). The alignment frame is configured to align a connection between the BGA socket and the PCB. The gasket is to seal the CPU, the BGA socket, and the alignment frame between the PCB and the top plate. The back plate is configured to couple with the top plate through the PCB.

A method for manufacturing a circuit board is provided, including providing a substrate. A first inkjet printing step is performed to apply a plurality of ink droplets to the substrate to form a plurality of microstructures arranged along a first direction. The microstructures therebetween form a plurality of recesses extended along a second direction that is different from the first direction. Also, a second inkjet printing step is performed to apply a plurality of conductive ink droplets to the microstructures, wherein the recesses between the microstructures are filled with the conductive ink droplets.

An electric component includes a printed circuit board with each of a pair of surfaces serving as a component mounting surface. The component mounting surface has a predetermined region on which electronic components are coated with a resin. A predetermined one of the electronic components in the region is not covered with the resin at a portion above a predetermined height from the component mounting surface.

A display device includes: a display panel having a front portion, a first bending portion, a second bending portion, and a corner portion, the display panel including a plurality of first pixels disposed in the front portion and a plurality of second pixels disposed in the corner portion. The display panel includes: a substrate; a first dam surrounding the plurality of first pixels; and a second dam surrounding the plurality of second pixels. The substrate includes a plurality of cutout patterns disposed in the corner portion, the plurality of second pixels and the second dam are disposed in each of the plurality of cutout patterns, and a height of an upper surface of the first dam is higher than a height of an upper surface of the second dam, based on one surface of the substrate.