The proposed masking dam protects ball grid array integrated circuit components from conformal coating overflow, preventing joint breakage and thermal mismatch. The masking dam includes a frame with an integrated seal, a cover, and a fastening mechanism. The frame is sealed to a circuit board surround a component, the cover is attached to the frame, and the masking dam is secured to protect the component.

The present disclosure provides a stretchable circuit substrate comprising: a base material being stretchable; a wiring which is on a first surface side of the base material, and which includes a bellows-like member including a plurality of ridges and recesses arranged in a first direction which is one of in-plane directions in the first surface of the base material; and an adjustment layer which includes the bellows-like member and is on the first surface side of the base material so as to at least overlap, in a plan view, a wiring region in which the wiring is positioned; wherein the adjustment layer has a Young's modulus smaller than a Young's modulus of the wiring.

An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.

A display device may include a main flexible printed circuit including a first alignment mark and electrically connected to a first panel; and a touch flexible printed circuit including a second alignment mark and electrically connected to a second panel that is perpendicular to the first panel, wherein the main flexible printed circuit is electrically connected to the touch flexible printed circuit through a pad region, and the touch flexible printed circuit includes a first overcoat region disposed between the first alignment mark and the second alignment mark.

Provided are a flexible circuit board for forming a protective layer on an inner lead region, a manufacturing method therefor, and a package having the flexible printed circuit board. The flexible circuit board comprises: a base layer; a wiring layer which includes a plurality of electrode lines each having an inner lead and an outer lead respectively provided on both sides thereof and which is formed on at least one surface of the base layer; a first protective layer formed on the wiring layer so as to expose the inner lead and the outer lead of the electrode line; and a second protective layer formed in an inner lead region that is formed by being encompassed by the first protective layer.

A electronic device including a host connector and memory device is provided. The host connector includes a connector pin, and the memory connector includes a connection terminal electrically connected to the connector pin of the host connector. The connector pin includes a first conductor part including a conductor, a second conductor part including the conductor, the second conductor part being bent from the first conductor part in a direction towards the connection terminal, and a stub including an insulator, the stub being bent from the second conductor part in a direction away from the connection terminal. The connection terminal includes a first region including an insulator, and a second region including a conductor. The second conductor part is electrically connected to the second region, so that the host connector is electrically connected to the memory connector.

A functional contactor is provided. A functional contactor according to an exemplary embodiment of the present invention comprises; a clip-shaped conductor having elasticity which is in electrical contact with a conductor of an electronic device; a functional element which is electrically connected to the clip-shaped conductor in series via a solder and comprises a first electrode and a second electrode respectively provided on the entire upper and lower surfaces thereof; and an arrangement guide which is formed to surround at least a part of the clip-shaped conductor on the upper surface of the functional element so as to arrange the position of the clip-shaped conductor and is made of nonconductive resin.

An electronic device and methods for fabricating the same are disclosed herein that utilize a dam formed on a printed circuit board (PCB) that is positioned to substantially prevent edge bond material, utilized to secure a chip package to the PCB, from interfacing with the solder balls transmitting signals between the PCB and chip package.

A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.

A printed circuit board (PCB) core structure is provided for the transition of signals from one side of a PCB to an opposing side of the PCB. The PCB core structure may include a laminated core including an inner core including a plurality of conductive layers (N layers), a first dielectric layer, a first conductive trace disposed over the Nth conductive layer on a first side of the laminated core. The PCB core structure may also include a signal via extending from a first conductive layer to an Nth conductive layer through the laminated core, the signal via configured to connect the first conductive trace to a pin or a second conductive trace on a second side of the laminated core. The PCB core structure may also include a shielding structure surrounding the signal via and partially extending from the first conductive layer to the Nth conductive layer. The PCB core structure may also include a cavity removing a portion of the shielding structure in the Nth conductive layer and filled with a dielectric material. The cavity filled with the dielectric material prevents the first conductive trace from shorting to the shielding structure. The PCB core structure may be fabricated by using a single-lamination cycle.