A packaging system comprises: a package forming a set of discrete compartments; and a film portion interfacing with the package. The film portion includes a set of one or more electrically conductive traces in which each electrically conductive trace is associated with a respective compartment of the set of discrete compartments. Each electrically conductive trace of the set of electrically conductive traces forms a respective circuit loop that has a terminal end that terminates within an interface region of the film portion to collectively form a termination pattern. At least one of the package or the film portion have two or more alignment ports defined therein that are arranged according to an alignment pattern, each alignment port passing through at least one of the package or film portion.

An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

A method for mounting a printed circuit board for an automotive vehicle on a carrier structure including at least one rivet. The printed circuit board includes at least one mounting aperture that is capable of accommodating the rivet and which defines an electrical conduction zone and at least one mark having a control end up to which the mark extends over the electrical conduction zone. The method includes a step of positioning the printed circuit board on the carrier structure such that the rivet extends through the mounting aperture, a step of riveting the rivet such that its head is at least partly flattened on the electrical conduction zone and a step of determining the conformity of riveting when the head of the rivet covers the control end of the mark.

A display device includes a display unit including transistors disposed in a display area and signal lines arranged in a non-display area located along an edge of the display area, at least one of the signal lines being electrically connected to the transistors; and an input sensing unit disposed over the display unit and including sensing electrodes disposed on the display area, sensing lines arranged on the non-display area, and a first dummy pattern disposed on the non-display area and spaced apart from the sensing electrodes as compared with the sensing line, wherein the first dummy pattern overlaps a first signal line of the signal lines, the first signal line being spaced farthest from the display area, a planar shape of an overlap pattern formed by overlapping the first dummy pattern and the first signal line coincides with a planar shape of an alignment mark.

A packaging system comprises: a package forming a set of discrete compartments; and a film portion interfacing with the package. The film portion includes a set of one or more electrically conductive traces in which each electrically conductive trace is associated with a respective compartment of the set of discrete compartments. Each electrically conductive trace of the set of electrically conductive traces forms a respective circuit loop that has a terminal end that terminates within an interface region of the film portion to collectively form a termination pattern. At least one of the package or the film portion have two or more alignment ports defined therein that are arranged according to an alignment pattern, each alignment port passing through at least one of the package or film portion.

A method for positioning at least one electronic component (3) on a circuit board (1) provided for installation in a vehicle headlamp, wherein the circuit board (1) comprises at least one position mark and the at least one electronic component (3) is positioned relative to the at least one position mark on the circuit board (1), wherein the at least one position mark is detected optically and is used for positioning, wherein the at least one position mark used is at least one alignment mark (5, 6, 7, 8, 8, 8) of the circuit board (1) which, in the vehicle headlamp, when the circuit board (1) is installed, interacts mechanically with a positioning means (9, 15) of the vehicle headlamp that is complementary to the alignment mark (5, 6, 7, 8,8, 8).

An electronic apparatus includes a display panel including a base substrate including an active area and a peripheral area adjacent to the active area, pixels on the active area, pads on the peripheral area and arranged in a first direction, signal lines connecting the pixels to the pads, and a vernier mark on the peripheral area and spaced apart from the pads and the signal lines, a circuit board on the display panel and including a base film, and leads on the base film and overlapping with the pads in a plan view, and a conductive adhesive member extending in the first direction and between the display panel and the circuit board to connect the pads to the leads. The conductive adhesive member overlaps with the vernier mark when viewed in a second direction intersecting the first direction.

A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1.sup.st-1.sup.st output pad group and a 1.sup.st-2.sup.nd output pad group, the second output pad region includes a 2.sup.nd-1.sup.st output pad group and a 2.sup.nd-2.sup.nd output pad group, the fourth output pad region includes a 4.sup.th-1.sup.st output pad group and a 4.sup.th-2.sup.nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1.sup.st-1.sup.st output pad group, a second input terminal electrically connected to the 2.sup.nd-2.sup.nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4.sup.th-2.sup.nd output pad group.

A circuit board includes an assembly and a labeling area. The assembly area is for installation of the elements. The labeling area is for marking of the circuit board. A paint layer is coated on a surface of the labeling area. A two-dimensional code is printed on the paint layer. A camera module having the circuit board and a method for labeling the circuit board are also provided.