A lighting device comprising a carrier board and an array of lighting elements mounted on the carrier board. The carrier board has a generally spiral shape and the carrier board can be tessellated with one or more identical other carrier boards with windings interleaved with each other. This enables multiple carrier boards to be formed from a single substrate with little or no waste of material. Different designs enable two, four or even more different identical carried board shapes to be tessellated together.

A light emitting device (10) includes light emitting elements (12), conductor wirings (14), and alignment marks (18) formed on a substrate (11). The alignment marks (18) and the conductor wirings (14) are formed by printing.

Provided is an electro-optical panel including a first area in which a circuit is formed and a first terminal area and a second terminal area that are arranged side-by-side in a Y direction when viewed from the first area. The first terminal area and the second terminal area are each provided with a terminal group including a plurality of terminals arranged in an X direction different from the Y direction, and at least one of wires from the first terminal area to the first area and from the second terminal area to the first area extends from between the first terminal area and the second terminal area and reaches the first area through an area outside of the first terminal area when viewed from a central axis of the electro-optical panel extending in the Y direction.

A wiring substrate includes a first insulation layer having a component mounting area and a mark formation area, an electrode pad arranged in the component mounting area and having an upper surface exposed from the first insulation layer and a side surface and a lower surface embedded in the first insulation layer, and a mark arranged in the mark formation area and formed of an insulation pattern layer having an upper surface exposed from the first insulation layer and a side surface and a lower surface embedded in the first insulation layer. A color of the first insulation layer and a color of the insulation pattern layer are different.

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

A system and method for marking components of an assembly and/or portions of an assembly including at least one of the components with a plurality of markers, each component and/or portion including its own marker or markers, to be read in an operational sequence so as to generate at least one identifier representative of a characteristic and/or feature of the assembly. Any marker can be a certain type of marker, the combination of which can be used to generate an identifier. A certain type of marker 1 need not be dedicated to a certain component. Each marker can be associated with a proxy value, which can be obtained by reading the marker with a reader. An identifier of the assembly can then be generated by employing a predetermined sequence of reading the markers.

A glass substrate having a plurality of holes includes a first surface and a second surface, which are opposite to each other. Each of the holes is arranged so as to have an aperture on the first surface. The plurality of holes includes a first hole group including a plurality of first holes having a first aperture diameter including a first variation, and a second hole group including a second hole or a plurality of second holes having a second aperture diameter including a second variation. Each of the first holes has an aspect ratio of greater than 1, and a surface roughness on an inner wall (arithmetic average roughness Ra) of less than 0.1 m. The second aperture diameter is greater than the first aperture diameter by 15% or more, or less than the first aperture diameter by 15% or more.

A lighting device comprising a carrier board and an array of lighting elements mounted on the carrier board. The carrier board has a generally spiral shape and the carrier board can be tessellated with one or more identical other carrier boards with windings interleaved with each other. This enables multiple carrier boards to be formed from a single substrate with little or no waste of material. Different designs enable two, four or even more different identical carried board shapes to be tessellated together.

A method is used to identify and compensate for errors created by changes in the relative positions of a deposition unit and a vision system of a dispenser. The method includes calibrating the vision system, dispensing a pattern of features over a working area, moving the vision system over a deposition location to locate a deposition, obtaining an image of the deposition, tagging data associated with the image, calculating a relative distance between the deposition unit and the vision system, storing correction data with spatial location in a file for later use, and using the stored data to make small corrections prior to dispensing additional material.

An objective of the present invention is to prevent a copper foil used as a recognition mark from being stripped from a base film in a flexible printed board while preventing the recognition accuracy for the recognition mark from being reduced. A flexible printed board includes a base film; a copper foil pattern on the base film, wherein the copper foil pattern has a hollow shape with an outer circumferential section and an inner circumferential section and is configured to function as a recognition mark; a coverlay having an opening formed therein, wherein the coverlay is bonded to the base film and covers the outer circumferential section of the copper foil pattern such that an edge of the opening is positioned between the outer circumferential section and the inner circumferential section of the copper foil pattern.