A circuit board structure includes a circuit board body having an adsorption surface; an auxiliary board on which a binding mark is disposed. The auxiliary board is spliced to the circuit board body, and a surface of the auxiliary board is flush with the adsorption surface. A part of the adsorption surface and a part of the surface of the auxiliary board together form an adsorption zone.

A display device includes a display panel including first and second signal pads respectively disposed at one side and the other side of a center axis extending in a first direction and first and second fixing pads spaced apart from each other with the first and second signal pads interposed therebetween, and a flexible film including connection pads overlapping the signal pads and first and second alignment pads groups spaced apart from each other with the connection pads interposed therebetween. The first alignment pad group includes n first alignment pads arranged in the first direction, the second alignment pad group includes n second alignment pads corresponding to the first alignment pads, and a distance between corresponding first and second alignment pads decreases as a distance thereof from a display area decreases.

The present invention relates to an improved system and method for manufacturing flexible circuit boards (FSBs) using optical alignment and various bonding systems. The invention provides an improved process to connect together the layers of rigid-flex, flexible, and printed circuit boards while maintaining alignment of the layers prior to and possibly after a lamination step. An optical alignment system is provided, a preferred arrangement is enabled as an automated pinless bonding system (PBS), for securely gripping, aligning, transferring, and clamping, bonding and moving a bonded FSB employing a multi-axis orientation. An alternative manual optical alignment and bonding system is provided.

The present disclosure relates to a machining station for machining platelike workpieces (1) by means of at least one tool, in particular a drilling station for machining at least one circuit board, as well as to a method for controlling or identifying a platelike workpiece (1). The machining station has at least one X-ray radiation source (3), at least one detector (4) and a table (2) that can be positioned between the X-ray radiation source (3) and the detector (4), on which the workpiece (1) to be machined can be fastened. The table (2) has a receiving plate (6) made out of a material permeable to X-rays (5), in particular a plastic. The receiving plate (6) has at least one suction port (11) for extracting air and a distribution grid, which is connected in terms of flow with the at least one suction port (11) and consists of several channels (10) unilaterally open in a support surface (9) with beveled and/or rounded edges (13) and/or of inclinedly running through openings (14).

A display device includes a first substrate including a display area and a non-display area, which is on the periphery of the display area, a light-emitting element disposed on the first substrate and in the display area, a display signal line which is disposed on the first substrate and in the display area, extends in a first direction, and transmits a signal to the light-emitting element, a common voltage supply line disposed on the first substrate and in the non-display area, a pad disposed on the first substrate and in the non-display area, and electrically connected to the display signal line, and an indentation pad disposed on the first substrate and in the non-display area, and electrically connected to the common voltage supply line, where the indentation pad is disposed closer than the pad to edges of the first substrate in a second direction, which intersects the first direction.

A display apparatus having a display panel that includes a first pad portion is provided. A flexible printed circuit board is configured to attach to the display panel. The flexible printed circuit board includes a second pad portion that is configured to electrically connect to the first pad portion. The first pad portion includes a plurality of first signal pads, a first test pad, and a first alignment pad having a first shape. The second pad portion comprises a second alignment pad having a second shape. The second alignment pad includes a first portion and a second portion that are spaced apart from each other. The first shape and the second shape are configured to form a predetermined alignment mark when the flexible printed circuit board is attached to the display panel at a predetermined position.

A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.

System and methods to enable integration of electronic components to form LED assembly with a high accuracy (0.1 mm or better) and high process capability (Cpk of 1.67 or higher) for realizing precision electro-mechanical device. The system and methods use through holes that connect a printed circuit board to a housing as fiducial marks and LED emitter center as a reference point for alignment in order to improve the efficacy and accuracy of assembling of the LED assembly. The through holes are drilled by using laser drilling or milling machine, Use of adhesive to anchor the LED component down prior to reflow process i.e. to avoid self alignment characteristic of component on solder paste during reflow process.

Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

A display apparatus having a display panel that includes a first pad portion is provided. A flexible printed circuit board is configured to attach to the display panel. The flexible printed circuit board includes a second pad portion that is configured to electrically connect to the first pad portion. The first pad portion includes a plurality of first signal pads, a first test pad, and a first alignment pad having a first shape. The second pad portion comprises a second alignment pad having a second shape. The second alignment pad includes a first portion and a second portion that are spaced apart from each other. The first shape and the second shape are configured to form a predetermined alignment mark when the flexible printed circuit board is attached to the display panel at a predetermined position.