A mark recognition device is applied to a substrate including a marked region. The mark recognition device includes; an image collecting mechanism and a first light source. The first light source emits a light beam, the light beam includes a first light beam and a second light beam. The first light beam is irradiated to the marked region of the substrate and blocked by a mark of the marked region to generate a marked orthographic projection on the image collecting mechanism. The second light beam is transmitted to the image collecting mechanism to form transmitted light. The image collecting mechanism recognizes the mark according to the marked orthographic projection of the mark and the second light beam. Recognition accuracy of the mark is effectively improved in embodiments of the present application.

An electronic apparatus includes a display panel including a base substrate including an active area and a peripheral area adjacent to the active area, pixels on the active area, pads on the peripheral area and arranged in a first direction, signal lines connecting the pixels to the pads, and a vernier mark on the peripheral area and spaced apart from the pads and the signal lines, a circuit board on the display panel and including a base film, and leads on the base film and overlapping with the pads in a plan view, and a conductive adhesive member extending in the first direction and between the display panel and the circuit board to connect the pads to the leads. The conductive adhesive member overlaps with the vernier mark when viewed in a second direction intersecting the first direction.

An organic light emitting diode (OLED) display device is provided. The OLED display device includes a display panel and a camera. A first alignment mark is formed on a low pixel density area of the display panel, a second alignment mark is formed in the camera, and arrangements of the first alignment mark and the second alignment mark are consistent. Therefore, an alignment accuracy between the camera and the display panel is improved, and a purpose of adopting a blind hole in the area where the camera is mounted on the display device and displaying normally is achieved.

Display device and fabrication method are provided. The display device includes a first substrate and a flexible circuit board. The first substrate includes a step region, first alignment marks, and a base substrate. The step region includes a bonding region and the bonding region includes a plurality of first pads arranged in at least one row along a first direction. The flexible circuit board is bonded in the bonding region and includes second alignment marks. Orthographic projections of the first alignment marks on a plane of the base substrate do not overlap an orthographic projection of the flexible circuit board on the plane of the base substrate, and do not overlap orthographic projections of the second alignment marks on the plane of the base substrate.

A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.

Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately. In an embodiment the invention includes a circuit board clamp for holding flexible circuit boards together, the clamp including a u-shaped fastener; a spring tension arm connected to the u-shaped fastener; and an attachment mechanism connected to the spring tension arm. Other embodiments are also included herein.

An organic light emitting diode (OLED) display device is provided. The OLED display device includes a display panel and a camera. A first alignment mark is formed on a low pixel density area of the display panel, a second alignment mark is formed in the camera, and arrangements of the first alignment mark and the second alignment mark are consistent. Therefore, an alignment accuracy between the camera and the display panel is improved, and a purpose of adopting a blind hole in the area where the camera is mounted on the display device and displaying normally is achieved.

A method for manufacturing a multilayer wiring substrate includes forming a resist layer having mask pattern, forming a conductor layer having conductor pattern using the resist layer, removing the resist layer, forming an insulating layer on the conductor layer such that the insulating layer is laminated on the conductor layer, forming a subsequent resist layer having mask pattern such that the subsequent resist layer is formed on the insulating layer, and forming a subsequent conductor layer having conductor pattern using the subsequent resist layer. The forming of the resist layer includes conducting first correction in which formation position of entire mask pattern of the resist layer is corrected with respect to reference position, and conducting second correction in which shape of the mask pattern of the resist layer is corrected with respect to reference shape, and the forming of the subsequent resist layer does not include conducting the second correction.

A display device includes: a display panel including a display area and a non-display area; a flexible printed circuit board overlapping and attached to the display panel; a pair of first alignment indicia disposed in the non-display area; a pair of second alignment indicia adjacent to the first alignment indicia; a pair of third alignment indicia disposed on the flexible printed circuit board.

Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Terminals may be inserted into the terminal holes and connected to conductive features or plating within the holes. A conductive element may be provided on the substrate to connect to a terminal. Alternatively solder may be dispensed into the holes for surface mounting.