A printed wiring board includes a lower layer including conductor layers and insulating layers, a conductor layer formed on the outermost insulating layer in the lower layer, and a solder resist layer formed on the conductor layer such that the solder resist layer is covering the conductor layer on the outermost insulating layer, and a two-dimensional code structure formed on the lower layer and including the conductor layer and a portion of the solder resist layer such that the portion of the solder resist layer has openings forming exposed portions of the conductor layer and that the openings of the solder resist layer and the exposed portions of the conductor layer form the two-dimensional code structure. The conductor layer includes a portion corresponding to the two-dimensional code structure such that the portion of the conductor layer has a residual copper rate that allows the two-dimensional code structure to be read.

A component carrier related body which includes a stack with a plurality of electrically conductive and/or electrically insulating layer structures, and at least two information carrying structures formed vertically displaced on at least two different of the layer structures, wherein at least two of the at least two information carrying structures are laterally displaced in a plan view on the stack.

A two-dimensional data matrix structure includes a first substrate, a first metal layer disposed on the first substrate, a second substrate disposed on the first metal layer, and a second metal layer disposed on the second substrate. The first metal layer has a plurality of sections and a plurality of empty regions formed according to a two-dimensional data matrix pattern. The first substrate, the second substrate, and the second metal layer commonly have a plurality of through holes, and positions of the through holes correspond to positions of the empty regions. The second substrate and the second metal layer commonly have a plurality of blind holes, and positions of the blind holes correspond to positions of the sections. The sections are exposed through the blind holes, and the configuration of the through holes and the blind holes is the two-dimensional data matrix pattern when viewed from above.

A system for tracking objects such as a printed circuit board (PCB) undergoing multiple manufacturing processes traceability system includes a coding unit, a scanning unit, and a reading unit and a database. The printed circuit board includes at least two inner copper foil substrates, subsequent substrates can be added. The coding unit marks identification and manufacturing stage codes on the inner copper foil substrate for through scanning by the scanning unit emitting X-rays. The reading unit can receive and parse the codes identified by the X-rays, and determine the previous or a next stage according to a predetermined encoding rule without risk of stage repetition or stage omission or product misplacement. The database stores standard identities and information as to manufacturing stages as a reference.

A component mounting device mounts an electronic component on a printed circuit board, and includes a sideview camera which takes an image of a side surface of a target, a mounting head having a nozzle shaft, and a driving device which moves the mounting head to a planar direction on a base. The nozzle shaft includes a shaft main body movably supported to a vertical direction with respect to the mounting head, and a suction nozzle attached at a tip of the shaft main body to suction and hold the electronic component, and an identification mark which identifies the suction nozzle is provided on a side surface of the suction nozzle.

A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

A circuit board comprising a contacting arrangement, including three metal contacting regions, which are connected with one or more data links of the circuit board and in the case of contact with a communication interface of a test system enable a data exchange with a data memory of a circuit board.

A mounter capable of curtailing interference between a mounting head that has a component holding section, and an exchange-use component holding section and a storage section that holds the exchange-use component holding section. A controller of the mounter reads head identification information for identifying the mounting head from the mounting head. Also, different quantities of protruding sections are formed on nozzle tray in accordance with the height in the Z-axis direction. Also, pressure switches that are pressed by protruding sections so as to turn on and off are provided on loading plate on which nozzle tray is loaded. By this, the controller is able to determine whether interference will occur between the mounting head and nozzle tray based on the detection signal of the pressure switches before the mounting head is moved.

A wiring circuit board includes a support metal layer; a base insulating layer disposed on at least one surface in the thickness direction of the support metal layer, and a wiring layer disposed on one surface in the thickness direction of the base insulating layer. A plurality of stripe grooves that extends along a predetermined direction orthogonal to the thickness direction and a plurality of recesses that sinks in the thickness direction of the support metal layer are formed on one surface in the thickness direction and/or the other surface in the thickness direction of the support metal layer. The recesses form a two-dimensional code having a generally rectangular shape in plan view by means of a dot pattern. One side of the two-dimensional code is disposed so as to lie along the stripe grooves.

A transferable film includes a carrier layer and an intermediate film portion. The carrier layer is configured to receive one or more additional layers and to be releasable from the one or more additional layers temporally proximate to an application of the transferable film to an object. The intermediate film portion includes a readable conductive image portion and is configured for application thereto of an adhesive layer. The intermediate film portion is configured to be interposed between the carrier layer and the adhesive layer, and the adhesive layer configured to adhere to the object for the application of the transferable film to the object.