A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.

An electronic module includes a substrate having a first main surface and a second main surface, first electronic components on the first main surface, second electronic components on the second main surface, a first sealing resin portion, and a second sealing resin portion. Through holes are formed so as to extend through the substrate and the first sealing resin portion. A third electronic component is placed in the through holes. An area between the through holes and the third electronic component is filled with the second sealing resin portion, and the second sealing resin portion is formed to be exposed at a surface of the first sealing resin portion. When viewed in a direction perpendicular to the first main surface, the second sealing resin portion surrounds the third electronic component. The first sealing resin portion and the second sealing resin portion are made of different types of resins.

A printed wiring board includes a copper foil pattern on a base material, a solder resist uniformly provided on the copper foil pattern so as to cover the copper foil pattern, and an outline character forming layer provided in a part where characters are not formed so that outline characters are formed on the solder resist. A method of manufacturing the printed wiring board includes a step of forming the copper foil pattern on the base material, a step of uniformly forming the solder resist on the copper foil pattern so as to cover the copper foil pattern, and a step of forming the outline character forming layer on the solder resist. The solder resist is formed by applying it by a spray method.

A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals in the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

An integrated multilayer assembly for an electronic device includes a first substrate film configured to accommodate electrical features on at least first side thereof, said first substrate film having the first side and a substantially opposing second side, a second substrate film configured to accommodate electrical features on at least first side thereof, said second substrate film having the first side and a substantially opposing second side, the first sides of the first and second substrate films being configured to face each other, at least one electrical feature on the first side of the first substrate film, at least one other electrical feature on the first side of the second substrate film, and a molded plastic layer between the first and second substrate films at least partially embedding the electrical features on the first sides thereof.

An electrical element includes an optically-detectable pattern of embedded information. A plurality of thin-film layers is applied on the surface of the substrate wherein one or more of the thin-film layers is at least partially transparent. The plurality of thin-film layers overlaps in an encoding region to form an optical layer structure, wherein at least one of the thin-film layers in the optical layer structure contributes to an electrical function of the electrical element. At least one of the thin-film layers in the optical layer structure includes an information-encoding pattern which contributes to an optically-detectable interference image when illuminated by incident light, and wherein the optically-detectable interference image corresponds to at least a portion of the pattern of embedded information.

A circuit board includes a plurality of circuit board areas, wherein the individual circuit board areas include at least one layer made of an in insulating base material and a conducting pattern located on or in, the base material, the following is provided: a substrate material, at least one registration mark formed in the substrate material, a first circuit board area arranged on the substrate material, at least one additional circuit board area, which substantially adjoins the first circuit board area or at least partially overlaps the first circuit board, the additional circuit board areas being oriented relative to the registration mark, and a plurality of connections of the conducting patterns of the first circuit board area and of the at least one additional circuit board area. Thus improved registration and orientation can be achieved when circuit board areas are coupled.

A lighting device for a motor vehicle, including an illuminated screen having a plurality of light sources arranged in a matrix on a substrate having a plurality of electrical interconnecting tracks that extend between the light sources. The substrate includes a first protective layer which is disposed between the light sources and has a first albedo, and a second protective layer which is disposed between the light sources and has a second albedo that is greater than the first albedo, the second layer defining a logo.