A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

A flat harness includes a plurality of flat circuit bodies that are stacked to each other. A mark is provided on a side surface of each of the plurality of flat circuit bodies. A position of the mark in a length direction of the flat circuit body is provided so as to be different for each type of the flat circuit body.

Methods and devices that identify a silkscreen data file associated with a physical printed circuit board and use an image of the physical printed circuit board to display a virtual silkscreen over the image of the physical printed circuit board.

The present disclosure provides a PCB board, a manufacturing method of a PCB board, and an electrical device, where the PCB board includes an insulating dielectric layer which is a glass substrate layer including a top surface and a bottom surface disposed oppositely; a conductive wiring layer which is disposed on a top surface of the insulating dielectric layer; and a top ink layer which is coated on the conductive wiring layer. According to the technical solution provided by the embodiment of the disclosure, the PCB board does not generate the phenomenon of deformation warping, and the conductive wiring layer is not easily peeled off from the insulating medium layer, and the use performance of the PCB board is good.

The present disclosure provides a double-sided two-dimensional coding, includes a transparent medium layer on which a metal layer is plated, and a two-dimensional coding image is fused through the metal layer. The present disclosure also provides a flexible printed circuit and manufacturing method for a double-sided two-dimensional coding. By lasering the metal layer corresponding to the transparent medium layer, the metal layer is fused through to form a two-dimensional coding image, and the transparent medium layer is retained as a carrier of the two-dimensional coding image, and an effect of reading the two-dimensional coding on both sides can be achieved.

An integrated circuit, a wireless communication card and a wiring structure of an identification mark are provided. The integrated circuit includes a power supply wiring, a ground wiring and at least one identification mark pattern. Each identification mark pattern has a first conductive wiring and a second conductive wiring that overlap each other, wherein the first conductive wiring is electrically connected to the power wiring, and the second conductive wiring is electrically connected to the ground wiring.

An In-Mold Electronics (IME) device and method of manufacturing the IME device introduce a stretchable substrate laminated to a thermoplastic layer. The stretchable substrate has a screen printable surface for receiving printed conductive interconnects. This combination enables formation of an IME device with conductive interconnects oriented for hard to reach cavities and areas. The IME device eliminates the need to have additional mold features to enable deeper drawn cavities.

A display device includes: a display panel including panel terminals; and a wiring substrate including first substrate terminals coupled to the panel terminals. The panel terminals include panel terminals arranged in a first region and panel terminals arranged in second regions sandwiching the first region. The first substrate terminals include first substrate terminals arranged in a third region and first substrate terminals arranged in fourth regions sandwiching the third region. A gap between panel terminals is substantially constant in the first and second regions. A first width of the panel terminals in the first region is different from a second width of the panel terminals is the second regions. A width of the first substrate terminals is substantially constant in the third and fourth regions. A first gap between first substrate terminals in the third region is different from a second gap between first substrate terminals in the fourth regions.

A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.