According to one embodiment, a printed circuit board includes a base substrate, a first pad located on the base substrate, a second pad located on the base substrate alongside the first pad with respect to a first direction X with a gap therebetween and a solder resist covering the base substrate and including a cavity portion in a position overlapping the first pad and the second pad, the solder resist including a first protruding portion projecting in a second direction crossing the first direction and a second protruding portion projecting in the second direction on an opposite side to the first protruding portion, and the first protruding portion and the second protruding portion each overlap the gap, an end of the first pad on a gap side, and an end of the second pad on a gap side.

An interface circuit includes: a connector connectable to a PC; a communication circuit capable of generating a transmission signal to another electronic device; a first region that is set between the connector and the communication circuit to allow an electrical isolation device to be mounted therein; wiring lines used to connect the communication circuit and the connector to each other through the first region; and wiring lines used to connect the electronic circuit and the connector to each other through a region other than the first region.

An interface circuit includes: a connector connectable to a PC; a communication circuit capable of generating a transmission signal to another electronic device; a first region that is set between the connector and the communication circuit to allow an electrical isolation device to be mounted therein; wiring lines used to connect the communication circuit and the connector to each other through the first region; and wiring lines used to connect the electronic circuit and the connector to each other through a region other than the first region.

A microchip includes a PCB, a first contact feature positioned along a first area of the PCB, a second contact feature positioned along a second area of the PCB that is disposed opposite the first area, a contact frame including first and second contact members respectively coupled to the first and second contact features for signal communication between the first and second contact features and an external electronic device, and a housing enclosing an interior region of the microchip and carrying the first and second contact members of the contact frame.

A display device includes a display substrate including a display area and a pad area, which is disposed on the periphery of the display area; and a display panel including at least one wire pad, which is disposed in the pad area of the display substrate, where the wire pad includes a main pad portion, which extends in a first direction, a first protruding pad portion, which protrudes from a first side, in a second direction intersecting the first direction, of the main pad portion, and a second protruding pad portion, which protrudes from a second side, in the second direction, of the main pad portion, and the first protruding pad portion is disposed closer than the second protruding pad portion to the display area.

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

According to one embodiment, a printed circuit board includes a substrate and a shared pad group provided on the substrate and including a plurality of shared pads. The shared pads include a first area, a second area smaller in size than the first area, a port of which is overlap the first area and an other port of which is located to protrude from the first area to a side of another one of the shared pads, and a second side edge located on a side of another shared pad. The second pad side edge includes a first side edge defining the first area, a second side edge defining the second area and displaced on a side of another shared pad with respect to the first side edge, and a sloping side edge connecting the first side edge and the second side edge to each other.

An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

One example of a system includes a printed circuit board. The printed circuit board includes a switch chip footprint to receive a higher lane count switch chip or a lower lane count switch chip. The printed circuit board includes a plurality of transceiver module footprints. Each transceiver module footprint is electrically coupled to the switch chip footprint. Each transceiver module footprint may receive a higher lane count transceiver module or a lower lane count transceiver module.