An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

Provided is an illumination device that includes a light emitting device having a first electrode and a second electrode and a mounting substrate including a first wiring pattern and a second wiring pattern. The first wiring pattern and the second wiring pattern face and are bonded to the first electrode and the second electrode, respectively, through a bonding material. The second electrode and the second wiring pattern are configured to be at least partially overlapped with each other in a plan view irrespective of an orientation of the light emitting device, under condition that the first electrode and the first wiring pattern are at least partially overlapped with each other in the plan view.

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices arid methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

An array substrate including a display area and a non-display area surrounding the display area. The non-display area includes a pad portion including one or more first pads that each have a parallelogram shape.

Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

The invention relates to a variable sensor interface for a control unit, this variable sensor interface including a circuit board which is provided with components. In a sensor interface which can easily be used for the use of different sensor types, the circuit board has a predefined conductive track layout having a plurality of predefined mounting locations, the mounting locations being provided with components in a sensor-specific manner.

A chip component includes external terminals on a mounting surface thereof at positions that are rotationally symmetric to each other by 180 degrees with respect to a center of the mounting surface. A substrate includes first and second mounting terminals on the mounting surface of the substrate at first diagonal positions of a square indicated by a two dot chain line, and third and fourth mounting terminals on the surface of the substrate at second diagonal positions of the square. The first and fourth mounting terminals are connected by a first terminal connecting portion, and the second and third mounting terminals are connected by a second terminal connecting portion. The chip component is configured to be mounted in any of four directions obtained by rotating the chip component every 90 degrees and achieves the same electrical characteristics.

A circuit board for an image forming apparatuses to which a first integrated circuit or a second integrated circuit is provided, includes an electric part provided to a first surface of the circuit board, a first attachment part provided to the first surface, to which at least one terminal of the first integrated circuit is attachable, a first conductor pattern formed on the first surface and configured to constitute at least a portion of a first wiring which connects the first attachment part and the electric part, a second attachment part provided to a second surface opposite to the first surface of the circuit board, to which at least one terminal of the second integrated circuit is attachable.

This application provides an electronic device. The electronic device comprises a first component, a second component and a circuit board. The circuit board includes a main board, a first type of solder pad, and a second type of solder pad. Both the first type of solder pad and the second type of solder pad are formed on a surface of the main board, and are electrically connected to the main board. The first type of solder pad includes a first solder pad and a first common solder pad, and the second type of solder pad includes a second solder pad and the first common solder pad. The first solder pad and the first common solder pad are configured to be simultaneously connected to the first component, and the second solder pad and the first common solder pad are configured to be simultaneously connected to the second component.