A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

Disclosed are a method and a structure for layout and routing of a PCB. The method includes: arranging signal lines, a power plane and a ground plane of the PCB in combination, where a portion of a reference plane for the signal lines is configured as a ground plane for providing a reference plane and return paths for the signal lines, to save routing spates. Layout of regions for the power supply, the ground and signal lines is appropriately designed, thereby improving the design density of a board, reducing the number of layers of the PCB, and saving cost.

Electromagnetic shields for electronic devices, and particularly electromagnetic shields with bonding wires for sub-modules of electronic devices are disclosed. Electronic modules are disclosed that include multiple sub-modules arranged on a substrate with an electromagnetic shield arranged on or over the sub-modules. Bonding wires are disclosed that form one or more bonding wire walls along the substrate. The one or more bonding wire walls may be located between sub-modules of a module and about peripheral boundaries of the module. The electromagnetic shield may be electrically coupled to ground by way of the one or more bonding wire walls. Portions of the electromagnetic shield and the one or more bonding wire walls may form divider walls that are configured to reduce electromagnetic interference between the sub-modules or from external sources.

A first trench is formed in a first sealing resin layer, which seals first electronic components and second electronic components on one main surface of a circuit board, and a second trench is formed in a second sealing resin layer, which seals third electronic components and fourth electronic components on another main surface. The first trench is formed between the first electronic components and the second electronic components when viewed in plan view, extending from an upper surface of the first sealing resin layer toward a surface opposite from the one main surface of the first sealing resin layer, and the second trench is formed between the third electronic components and the fourth electronic components when viewed in plan view, extending from a lower surface of the second sealing resin layer toward a surface opposite from the other main surface of the second sealing resin layer.

A redundant circuit device including a first system circuit and a second system circuit having identical function, the redundant circuit device comprises: a substrate that is partitioned into a first region in which a part of the first system circuit is provided and a second region in which a part of the second system circuit is provided, each of the first region and the second region having a printed wiring; a first mount component that is included in the first system circuit, has three or more pins, and is surface-mounted on one surface of the substrate; and a second mount component that is included in the second system circuit, has an identical number of pins as that of the first mount component and having an identical function as that of the first mount component, and is surface-mounted on the one surface.

An example computing device enclosure can include a first printed circuit board (PCB) that includes a first plurality of components, where a first portion of the first plurality of components that are shorter than a threshold height are positioned on a first side of the first PCB and a second portion of the first plurality of components that are taller than the threshold height are positioned on a second side of the first PCB, and a second printed circuit board (PCB) that includes a second plurality of components, where a first portion of the second plurality of components that are shorter than the threshold height are positioned on a first side of the second PCB and a second portion of the second plurality of components that are taller than the threshold height are positioned on a second side of the second PCB.

A driving device includes an electric motor, a rotating shaft, a motor housing, a printed circuit board, an electric power converting circuit, a rear frame end working as a heat radiating member, gel working as a heat transfer member, multiple mounted parts and so on. The heat radiating member is located on a side of the printed circuit board and facing a motor-side surface of the printed circuit board, to which multiple switching elements are mounted. The gel is plastically deformed and adhered to the switching elements and the heat radiating member for transferring heat of the switching elements to the heat radiating member. At least one of the mounted parts is mounted to the printed circuit board and located at a position between a through-hole opposing area and one of the switching elements, which is located at a position closest to a rotational angle sensor mounted to the printed circuit board in the through-hole opposing area.

A system of providing power including: a preceding-stage power supply module, a post-stage power supply module and a load, connected in sequence; a projection on the mainboard of a smallest envelope area formed by contour lines of the preceding-stage power supply module and the load at least partially overlaps with a projection of the post-stage power supply module; the preceding-stage power supply module includes a plurality of sets of preceding-stage output pins and preceding-stage ground pins alternately arranged to form a first rectangular envelope area, and the load is disposed on a side of a long side of the first rectangular envelope area; and the load comprises a load input pin and a load ground pin forming a second rectangular envelope area, and a center line of the first rectangular envelope area and the second rectangular envelope area is perpendicular to the long side of the first rectangular envelope area.

A substrate for a medical device, a portion of which is brought into contact with or inserted into a subject. The substrate includes a patient circuit conductively connected to the portion that is configured to be brought into contact with or inserted into the subject, and a ground-side circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit. The ground-side circuit is grounded by a protective ground to ensure safety of a manipulator of the medical device. The substrate also includes an insulating layer between the patient circuit and the ground-side circuit providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit.

The invention relates to a method for treating surfaces of an electronic card (4) by means of a plasma torch (1), said card (4) comprising a plurality of electronic components (C1a, C1b, C1c, C2a, C2b, C3a) and a plurality of surfaces to be treated, arranged at various heights relative to a reference plane (Ref) of the electronic card (4). At least one region to be treated (Zn) containing the surfaces to be treated is determined, strata (S1, S2, S3) which are parallel to said reference plane (Ref) and each contain at least one surface to be treated are determined, and then a torch movement path is generated such that: the surfaces are treated, stratum by stratum; for each stratum, the torch is exclusively moved in parallel with the reference plane (Ref); during the projection of the plasma flow (2), each treated surface is exclusively placed in the ideal working zone (Pt).