An object is to obtain a power conversion device that can suppress the generation of noise due to coupling and achieve the size reduction of a substrate. In a power conversion device, a main circuit wire for connecting main circuit components to form a main circuit includes a first main circuit wire and a second main circuit wire wired so as to be separated from each other on a substrate. A control wire is wired between the first main circuit wire and the second main circuit wire so as to be insulated therefrom, and the first main circuit wire and the second main circuit wire are connected to each other via the main circuit component placed so as to be separated from the control wire in the thickness direction of the substrate.

A board main body part has a multilayer structure with even-numbered layers including a first layer formed on a surface part on one side and a second layer formed on a surface part on the other side. On both of the first layer and the second layer, a low voltage region in which a low voltage circuit is disposed, a high voltage region in which high voltage circuits are disposed, and an insulating region in which the low voltage region is electrically isolated from the high voltage region are formed. At least a part of a first high voltage circuit is disposed in a first-layer high voltage region formed on the first layer, and at least a part of a second high voltage circuit is disposed in a second-layer high voltage region formed on the second layer.

The present application provides a method of bonding an integrated circuit chip to a display panel. The method includes forming a plurality of first bonding pads in a bonding region on a first side of the display panel; forming a plurality of vias extending through the display panel in the bonding region; subsequent to forming the plurality of vias, disposing an integrated circuit chip having a plurality of second bonding pads on a second side of the display panel substantially opposite to the first side, the plurality of second bonding pads being on a side of the integrated circuit chip proximal to the display panel; and electrically connecting the plurality of first bonding pads respectively with the plurality of second bonding pads by forming a plurality of connectors respectively in the plurality of vias.

A multi-socket panel device with an anti-crosstalk structure, wherein a plurality of through holes are formed on the circuit board. The through holes are arranged in two rows extending from one side of the circuit board to another side of the circuit board. Two electrical connectors disposed on the circuit board are arranged near two opposite sides of the rows of the through holes. The electromagnetic wave propagating in the circuit board are reflected or refracted by the through holes due to travel in different media, whereby the crosstalk caused by the electromagnetic wave is avoided when signals of high frequency are transmitted in two electrical connectors.

An electronic device module includes a substrate, a first component disposed on a first surface of the substrate, a sealing portion disposed on the first surface of the substrate, a second component disposed on the first surface of the substrate and embedded in the sealing portion, and a shielding wall at least partially disposed between the first component and the second component and including a portion having a height, with respect to the first surface of the substrate, that is lower than a height of the sealing portion.

Disclosed are a housing for receiving an electronic device and an electronic system having the same. The electronic system includes a case having lower and upper cases detachably combined with the lower case, a circuit board arranged in an inner space of the case and secured to the lower case such that at least a grounding line and at least a connection line are provided with the circuit board, a plurality of devices arranged on the circuit board such that each device is separated from one another by the grounding line and is connected with one another by the connection line, and at least an electromagnetic shielding member embedded onto the upper case such that the electromagnetic shielding member is in contact with the grounding line around the device to provide a shielding space receiving the device. The device is protected from unexpected electromagnetic waves by the electromagnetic shielding member.

The instant invention relates to a sub-miniature high powered light emitting diode and accompanying mounting tab device. The instant invention seeks to provide a solution to light fixture designers by making a readily available and tightly compact light emitting diode mounting device. The instant invention provides for a mounting tab with a heat dissipating element to take advantage of the tiny size of sub-miniature high powered light emitting diodes while adding negligible mounting and heat dissipating elements to set a new lighting device standard in versatility, optimal heat dissipation, and minimal mounting overhead.

A module includes: a board having a first main surface; a first component mounted on the first main surface; a first conductor column group including a plurality of conductor columns arranged on the first main surface along at least a part of an outer periphery of the first component; a first ground conductor disposed inside the board; a first conductor via group including a plurality of via conductors that connect the first ground conductor and an end of each of the conductor columns, the end of each of the conductor columns being located close to the first main surface; and a shield film disposed to cover over the first component. When viewed in a cross section taken along a plane perpendicular to the first main surface, the first component is at least partially surrounded by the first conductor column group, the first conductor via group, and the first ground conductor.

A system for incorporating electronic functionality into a flexible layer includes a flexible printed circuit board having a spine portion and one or more legs in electronic communication with the spine portion. Multiple pads may be disposed on the flexible printed circuit board. The spine portion and the one or more legs may be structured and arranged to be disposed within one or more pockets of the flexible layer. The system may further include electronic devices, each one of which may be in electronic communication with at least one of the pads. In addition, the system may include a controller in electronic communication with at least one of the pads. The system may be characterized by an absence of any external hard-wire interfaces for communication external to the system.

In accordance with at least one aspect of this disclosure, a system can include, a printed circuit board (PCB), a controller on the PCB configured to output a gate drive signal to one or more gate drivers 106 to drive a gate 108 of a switch (e.g., a transistor), and an isolation domain. The isolation domain can be defined in the PCB between the controller and the one or more gate drivers. More specifically, the isolation domain can begin at a first moat and end at a second moat, defined between the controller and the one or more gate drivers. The isolation domain can be configured to prevent common mode noise in the gate drive signal.