A curved electronic device (10c) can be formed by a stack with a curved substrate (13) comprising a thermoplastic material (Ms), and at least one electronic component (14) connected to an electronic circuit (15) disposed on the substrate (13). A component area (11) of the substrate surface (11.12) around the electronic component (14) comprises a first material (M1) providing relatively low absorption (A1) to light (L) and a surrounding area (12) of the substrate (13) outside the component area (11), comprises a second material (M2) providing relatively high absorption (A2) of the light (L). E.g. as a result of differential heating and thermoforming a first thickness (T1) of the substrate (13) in the component area (11) may be relatively high compared to a second thickness (T2) of the substrate (13) in the surrounding area (12).

An electronic device package is disclosed. The electronic device package includes a board on which an electronic device is mounted, a molded portion formed to cover the electronic device on the board, and a conductive layer disposed on a surface of the molded portion and extended in a trench formed on the board.

A case includes a header with a first isolation barrier, a cover with a second isolation barrier, and a printed circuit board (PCB) including a slot in which the first isolation barrier or the second isolation barrier is located and a primary-circuit side and a secondary-circuit side located on opposites sides of the slot.

A wireless power receiver for wirelessly receiving power from a wireless power transmitter comprises: a power reception circuit receiving electromagnetic waves emitted from the wireless power receiver so as to output power having an alternating current waveform; a rectifier for rectifying the power, having an AC waveform, outputted from the power reception circuit into power having a direct current waveform; a DC/DC converter for converting, into a voltage of a preset level, a voltage of the power having a direct current waveform, the power being rectified by the rectifier; a charger for charging a battery by using the power having a DC waveform, converted from the DC/DC converter; an alternating current ground connected to the power reception circuit and/or the rectifier so as to receive at least a portion of the power having an alternating current waveform; and a direct current ground connected to the DC/DC converter and/or the charger so as to receive at least a portion of the power having a direct current waveform, wherein the alternating current ground and the direct current ground can be disposed on different PCB layers, respectively.

A substrate for a medical device, a portion of which is brought into contact with or inserted into a subject. The substrate includes a patient circuit conductively connected to the portion that is configured to be brought into contact with or inserted into the subject, and a ground-side circuit configured to perform at least one of transmission of a signal, reception of a signal, and supply of electric power on the patient circuit. The ground-side circuit is grounded by a protective ground to ensure safety of a manipulator of the medical device. The substrate also includes an insulating layer between the patient circuit and the ground-side circuit providing insulation between the patient circuit and the ground-side circuit, and an isolated circuit provided apart from the patient circuit and the ground-side circuit on the insulating layer and having a different reference potential from the patient circuit and the ground-side circuit.

An electronic card comprising: a first card portion including lightning protection components, a first ground plane and a first ground zone; a second card portion comprising functional components, a second ground plane and a second ground zone; a third card portion, which separates and electrically isolates the first ground plane and the first ground zone from the second ground plane and from the second ground zone; the first ground zone and the second ground zone being unvarnished; the first ground zone and the second ground zone being arranged in order to be applied onto a housing element that is electrically conductive and that belongs to a housing in which the electronic card is integrated.

A method comprises: providing a circuit board comprising a first surface, an opposing second surface, and a ground connection; defining a shielding zone and a non-shielding zone on the first surface, one or more shielding-zone electronic components being comprised within the shielding zone; providing a groove in the circuit board, the groove extending along at least part of the shielding zone and being in-between the shielding zone and the non-shielding zone; applying an insulating encapsulation layer to cover the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated; applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded. Further, disclosed is a circuit board, and a hearing device comprising a circuit board.

The present disclosure provides a power supply system and an electronic device. The power supply system is used to supply power to a load and includes a system board where the load is disposed; a substrate; at least one output capacitor surface-mounted on the second side of the system board; at least one positive output conductive-connected region disposed on the first side of the substrate, and being electrically connected to one terminal of the at least one output capacitor; at least one negative output conductive-connected region disposed on the first side of the substrate, and being electrically connected to other terminal of the at least one output capacitor; and at least one power unit disposed on the second side of the substrate, and being electrically connected to the at least one positive output conductive-connected region and the at least one negative output conductive-connected region.

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine.

A multi-socket panel device with an anti-crosstalk structure, wherein a plurality of through holes are formed on the circuit board. The through holes are arranged in two rows extending from one side of the circuit board to another side of the circuit board. Two electrical connectors disposed on the circuit board are arranged near two opposite sides of the rows of the through holes. The electromagnetic wave propagating in the circuit board are reflected or refracted by the through holes due to travel in different media, whereby the crosstalk caused by the electromagnetic wave is avoided when signals of high frequency are transmitted in two electrical connectors.