A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

A radio frequency transmission structure couples a RF signal between a first and a second radiating elements arranged at a first and a second sides of a first dielectric substrate, respectively. The RF coupling structure comprises first and second coupling structures. Each coupling structure has a hole arranged through the first dielectric substrate, a first electrically conductive layer arranged on a first wall of the hole to electrically connect a first and a second signal terminals, a second electrically conductive layer arranged on a second wall of the hole opposite to the first wall to electrically connect a first and a second reference terminals. The first electrically conductive layer is separated from the second electrically conductive layer. The first and second coupling structures are symmetrically arranged with the first electrically conductive layers closer to each other than the second electrically conductive layers are to each other.

An electromagnetic wave transmission board proofed against internal signal leakage includes an inner plate, a first outer plate, a second outer plate, a first plate bump, a first conductive bump, a second plate bump, and a second conductive bump. The inner plate defines a first through hole with a plated metal layer on the hole wall. The first and second plated bumps are disposed between the first outer and inner plates. The second plate bump and the second conductive bump are disposed between the second outer plate and the inner plate. The plate metal layer, the first plate bump, the first conductive bump, the first outer plate, the second outer plate, the second conductive bump, and the second plated bump jointly form an air-filled chamber. A method for manufacturing the electromagnetic wave transmission board is also provided.

A component carrier which includes a stack having at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a recess being at least partially formed in the stack, optionally having an electrically conductive coating, and being configured as waveguide, wherein a plurality of edges delimiting the recess are formed by electrically conductive material of the at least one electrically conductive layer structure and/or of the optional electrically conductive coating.

An improved intrinsically safe mobile device is designed to reduce sparking risk and surface heating while still maintaining a form factor, processing speed, and functionality comparable to conventional mobile devices. Non-intrinsically safe electronic components are mounted on an unprotected part of a printed circuit board (PCB) contained within the mobile device and are encapsulated to reduce risk of sparking and to minimize surface heating to enable the encapsulated electronic components to be certified as intrinsically safe. The encapsulated electronic components are connected using a trace with intrinsically safe electronic components mounted on a protected part of the PCB and are connected with user interface components using FPC cabling. The trace and FPC cabling are certified as intrinsically safe using one or more protection techniques, such as through use of a resistor, a double MOSFET clamping circuit, a capacitor, a fuse, or maintaining a minimum clearance space.

A power supply includes a main circuit board and a multilayer power transmission board for transmitting power from one area of the main circuit board to another area of the main circuit board. The main circuit board includes a power input connector having power connections. The multilayer power transmission board includes conductive layers electrically coupled to the power connections of the power input connector, and a dielectric medium positioned between each of the conductive layers. The conductive layers of the multilayer board may include at least two conductive neutral layers and at least two conductive line layers positioned in an alternating configuration. Other example power supplies, multilayer boards and methods of manufacturing power supplies are also disclosed.

Components, methods of forming components, and methods of assembling components on an electronic device are provided. For example, a method of forming a component includes providing a first substrate having a first surface, a second surface opposite the first surface along a height direction, and an initial thickness from the first surface to the second surface along the height direction; forming one or more vias in the first substrate, each via extending from the first surface to the second surface of the first substrate; depositing one or more conductive pathways on the first surface of the first substrate; plating the one or more vias; disposing a second substrate on the first surface of the first substrate to form a component sandwich; processing the second surface of the first substrate to reduce a thickness of the component sandwich; and forming one or more contact pads on the first substrate.

An LED light tube includes a glass tube, end caps, an LED light strip, LED light sources, and a power supply module. The end caps are respectively attached at two ends of the glass tube. The LED light strip is attached to an inner circumferential surface of the glass tube. The LED light sources are mounted on the LED light strip. The power supply module is electrically connected to the LED light strip. Each of the end caps includes a lateral wall and an end wall. The lateral wall is substantially coaxial with the glass tube and connected to the glass tube. The end wall is substantially perpendicular to an axial direction of the lateral wall and connected to an end of the lateral wall away from the glass tube. The power supply module includes a rectifying circuit and a filtering circuit electrically connected to the rectifying circuit.