Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).

A high-frequency circuit including a circuit board which bears at least one electronic component and a conductor structure, and including a waveguide structure manufactured separately from the circuit board. The waveguide structure is positioned on the circuit board in such a way that high-frequency signals are transferable between the conductor structure on the circuit board and the waveguide structure. The waveguide structure is held with the aid of press-fit pins on the circuit board.

Provided is a device for transmitting signals, the device including: a first conductive base and a second conductive base parallel to each other, a waveguide at least partially surrounded by side walls located between the first conductive base and the second conductive base and including at least one electromagnetic band gap (EBG) structure, and at least two directional antennas opposite to or facing each other in a direction in which signals are transmitted, wherein each antenna is on a printed circuit board and includes another EBG structure located on an upper layer and a lower layer of the printed circuit board and at least one matching element, at least a part of each of the antennas is located inside the waveguide to form a wireless channel configured to transmit electromagnetic signals in an area between the antennas, and the at least one matching element is located within a specified distance of the wireless channel and is configured to match the antenna with the wireless channel.

A hybrid multi-layered optical flexible printed circuit device, comprising: an optical flexible substrate including a first open window and a second open window with a first, a second surfaces opposite to each other; an intrinsic film including a first bonding region aligned with the first open window and a second bonding region aligned with the second open window formed on the first surface; an optical waveguide film including a first notch with a first slant surface aligned with the first bonding region, and a second notch with a second slant surface aligned with the second bonding region formed on the second surface and encompassed the first open window and the second open window; a first flexible printed circuit board formed on the optical waveguide film; and a first optoelectronic device and a second optoelectronic device mounted in the first bonding region and the second bonding region of the intrinsic film.

System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

Waveguide assemblies are described that utilize a surface-mount waveguide for vertical transitions of a printed circuit board (PCB). The surface-mount waveguide enables low transmission-loss (e.g., increased return-loss bandwidth) by utilizing a waveguide cavity positioned over a plated slot to efficiently transfer electromagnetic energy from one side of the PCB to another side. The waveguide cavity is designed to excite two resonant peaks of the EM energy to reduce a return-loss of power and increase power delivered to an antenna while supporting a high bandwidth of EM energy. Furthermore, the surface-mount waveguide does not require precise fabrication often required for vertical transitions, allowing the surface-mount waveguide to be compatible with low-cost PCB materials (e.g., hybrid PCB stack-ups).

A method of fabricating a printed circuit assembly includes providing a flexible-hybrid circuit having a base and at least one side panel. The at least one side panel is hingedly connected to the base. The method further includes disposing a support structure on the flexible-hybrid circuit. The support structure includes a base, which is disposed on the base of the flexible-hybrid circuit, and at least one side that corresponds to the at least one side panel of the flexible-hybrid circuit. The method further includes folding the at least one side panel of the flexible-hybrid circuit so that the at least one side panel is disposed co-planar with the at least one side of the support structure to create a printed circuit assembly.

The present disclosure relates to phase shifters, antennas, and base stations. One example phase shifter includes a cavity, a built-in printed circuit board (PCB), and a stress relief portion. The stress relief portion is connected to the PCB, and the stress relief portion is configured to reduce a stress generated due to different coefficients of thermal expansion (CTE) of the cavity and the PCB.

System, apparatuses and methods are disclosed which relate to the use of substrate integrated waveguide technology in front-end modules. An example circuit card assembly for use as a cellular base station front-end is disclosed which includes at least one component printed circuit board (PCB) layer having front-end module hardware components and at least one filter PCB layer including at least one substrate integrated waveguide (SIW) filter.

A component carrier which includes a stack having at least one electrically conductive layer structure, at least one electrically insulating layer structure, and a recess being at least partially formed in the stack, optionally having an electrically conductive coating, and being configured as waveguide, wherein a plurality of edges delimiting the recess are formed by electrically conductive material of the at least one electrically conductive layer structure and/or of the optional electrically conductive coating.