Patent classifications
H05K2201/0999
Structure, wireless communication device and method for manufacturing structure
A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).
Appliance User Interface Panel Having Integrated Components
A user interface for an appliance is provided, including a user interface panel and a control component attached to the user interface panel. The user interface panel includes a plurality of traces for providing an electrical connection for the control component. The plurality of traces are integrally formed with the user interface panel such that the plurality of traces and the user interface panel are a single, unitary component. In some embodiments, the unitary user interface panel is curved. A method for forming a unitary user interface of an appliance also is provided, including establishing courses of a plurality of traces of the unitary user interface; converting the courses into control data for use in a laser direct structuring process; and using the laser direct structuring process to integrally form the plurality of traces with a user interface panel to form a unitary user interface panel.
Stackable security wraps
The present invention provides a security assembly for protecting a device includes first and second security wraps fitted to the device. The first security wrap covers a first area of the device. The second security wrap partially overlaps the first security wrap and covers a second area of the device. Each of the first and second security wraps has a security screen having first and second screen terminals and a conductive track extending between the first and second screen terminals. A conductive structure is disposed in an overlapping area between the first and second security wraps and coupled to the second screen terminal of the first security screen and to the first screen terminal of the second security screen.
Transmission line structure and method of attaching transmission line structure to conductive body
A method comprises mounting a grounding clip to a planar flexible printed circuit transmission line; clamping the grounding clip to an inner wall of a chassis of an electronic device; and operating a laser beam to weld the grounding clip to the chassis to route the flexible printed circuit transmission line along the inner wall. Welding the grounding clip to the chassis causes the grounding clip to remain in contact with the planar flexible printed circuit transmission line to ground the planar flexible printed circuit transmission line to the chassis.
Environment-tolerant tamper-proof circuit board
A circuit board is protected by being enclosed in a security housing that includes conductive tamper traces running along its interior surface, the conductive tamper traces being a housing portion of a tamper detection circuit. The tamper detection circuit also includes a board portion that detect tampering with the tamper detection circuit by monitoring voltages at monitor nodes along the board portion. The board portion of the tamper detection circuit is connected to the tamper traces via multiple connector pieces. The connector pieces can be held in place by board connector piece holders affixed to the board or housing connector piece holders of the housing. When tampering is detected, it can be localized based on voltages measured at multiple recesses along the housing. The tamper detection circuit can be arranged in a wheatstone bridge layout for environmental tolerance. The circuit board's functions/components can be disabled if tampering is detected.
Monitoring circuitry
In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.
Versatile and reliable intelligent package
A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.
Flexible printed circuits with bend retention structures
An electronic device may be provided with printed circuits. Electrical components may be interconnected using signal paths formed from metal traces in the printed circuits. The printed circuits may include flexible printed circuits with bent configurations. The flexible printed circuits may be provided with integral bend retention structures. A bend retention structure may be formed from a polymer layer, a solder layer, a stiffener formed from metal or polymer that is attached to flexible printed circuit layers with adhesive, a conformal plastic coating that covers exposed metal traces at a bend, a metal stiffener with screw holes, a shape memory alloy, a portion of a flexible printed circuit dielectric substrate layer with a reduced elongation at yield value, or combinations of these structures. The bend retention structure maintains a bend in a bent flexible printed circuit.
Electroplated plastic chassis for electronic device
In one example an electronic device comprises a controller and a chassis comprising a polymer layer, a first metallic layer deposited on a first side of the polymer layer, and a second metallic layer deposited on a second side of the polymer layer, wherein at least one of the first metallic layer or the second metallic layer comprises an electrically functional integrated structure. Other examples may be described.
WORK VEHICLE SYSTEMS INCLUDING MULTILAYER WIRING PANELS
This disclosure relates to embodiments of work vehicle systems including multilayer wiring panels (MWPs), which provide electrical interconnections to various electronic devices integrated into the work vehicle system. In embodiments, a work vehicle system includes a work vehicle component having a component housing which a first MWP is mounted. The first MWP includes a multilayer panel body having a non-planar cross-sectional shape generally conformal with a topology of a non-planar mounting surface of the component housing, preplaced wires embedded in the multilayer panel body, and panel input/output (I/O) interfaces electrically connected by the preplaced wires. The panel I/O interfaces contain first and second panel I/O interfaces electrically coupled to the controller and to the first integrated electronic device, respectively, such that the controller is placed in signal communication with the first integrated electronic device through the first MWP during operation of the work vehicle system.