A bone conduction speaker is provided. The bone conduction speaker includes: a housing forming an exterior; a stator including a pole piece fitted to a bottom of the housing and a voice coil arranged to an outer circumference of the pole piece; a vibrator including a permanent magnet mounted concentrically with the pole piece and voice coil, with an air gap from the pole piece, a weight attached to the permanent magnet to increase a vibration force, and a yoke attached to the permanent magnet and weight; a flexible printed circuit board mounted on the bottom of the housing, part of which extends out of the housing, and configured to transmit a signal to the voice coil; and a bone conduction pad attached to an outer surface of the housing. The vibration of the vibrator is transmitted to a bone of a user through the housing and bone conduction pad.

An electronics unit includes a housing, the housing having a base portion with a post member extending from the base portion. The post member has a through-hole defined through the post member. A printed circuit board is connected to the housing at a plurality of connection points. The printed circuit board includes one or more electric or electronic components disposed thereon and has an aperture. The post member is disposed through the aperture of the printed circuit board. A distal end portion of the post member is larger than a diameter of the aperture so as to fix the printed circuit board to the housing, forming one of the connection points. A seal member is disposed at least partly within the through-hole of the post member and forms a seal with the post member.

A method for the large-scale production of PCBs including a continuous selective adhesion process for creating printed circuit traces providing input to a production line. A roll of printed circuit traces is produced using rolls of flexible substrate, conductive layer, and conductive layer support by applying adhesive between the rolls of flexible substrate and conductive layer, bringing the rolls together, transferring a circuit pattern onto the flexible substrate, curing the adhesive through non-opaque areas of the circuit pattern, and separating the non-bonded areas. The resulting printed circuit traces are applied from the roll to mounts, and circuit components are applied from a roll to the traces as the mounts move along the line. Additional rolls of printed circuit traces and circuit components may be incorporated, and multi-layer PCBs may be produced. As part of the production line, the finished PCBs may be applied to flat or contoured products.

An electronic device according to various embodiments of the present invention may comprise a housing; an inner plate which is built into the housing, at least a portion of which is made of a synthetic resin material, and which comprises a first surface, a second surface facing the opposite direction to the first surface, a first through-hole formed in a cone-shaped cross-section the diameter of which gradually decreases the closer to the second surface from the first surface, and a second through-hole formed in a cone-shaped cross-section, which is disposed adjacent to the first through-hole and the diameter of which gradually decreases the closer to the first surface from the second surface; a first conductive line which is formed on the first surface and is formed to overlap with the first through-hole at least partially when viewed from the first surface, a second conductive line which is formed on the second surface and is formed to overlap with the second through-hole at least partially when viewed from the second surface, a first conductive layer which is deposited conformally on an inner wall of the first through-hole and electrically connected to at least one of the first conductive line and the second conductive line, a second conductive layer which is deposited conformally on an inner wall of the second through-hole and electrically connected to at least one of the first conductive line and the first conductive line, and a wireless communication module which is electrically connected to at least one of the first conductive line and the second conductive line, wherein the first conductive line, the second conductive line, the first conductive layer, and the second conductive layer may comprise the same composition of materials. Such an electronic device may vary according to the embodiment.

Reliable resin packages and semiconductor light-emitting devices using the resin package can include a printed circuit board including a resin layer, metallic layers formed on a top surface of the resin layer and underneath a bottom surface of the resin layer and a frame arranged from a top surface of the printed circuit board toward a bottom surface of the printed circuit board. The semiconductor light-emitting device using the resin package can prevent the printed circuit board from warping toward the frame when forming the frame incorporating the printed circuit board because a total of each thickness of the metallic layers formed on the top surface and underneath the bottom surface of the resin layer can be thicker than a thickness of the resin layer. Thus, the present invention can provide the semiconductor light-emitting devices having high reliability, which can be used as a light source for vehicle lamps, etc.

Disclosed is a wiring board, including: a base body having insulating properties; and a wiring conductor positioned on the base body. The base body has a first surface, a fourth surface positioned opposite to the first surface, and a second surface and a third surface positioned at side surfaces between the first surface and the fourth surface. The first surface, the second surface, and the third surface are mounting surfaces for respective electronic components, and the fourth surface is an installation surface.

An embodiment includes eyewear having an optical element, electronic components, a support structure configured to support the optical element and the electronic components, and light emitting diodes (LEDs) coupled to the electronic components and supported by the support structure. The LEDs are positioned to illuminate the support structure according to a lighting scheme.

A multi-function rearview device for use with a vehicle includes a housing configured to be attached to the vehicle and to be moveable relative to the vehicle, a rearview element including at least one of a reflective element, a camera and a display element, a bezel formed at an outer portion of the multi-function rearview device surrounding the rearview element, with the rearview element being attached to at least one of the bezel and the housing, one or more light assemblies providing at least one or more light function indications, including a Human Machine Interface (HMI), and at least one sensor, the sensor controlling the one or more light assemblies or the display element.

A payment reader is provided for use in a payment system. The payment reader includes a housing, a non-conductive cover covering the housing and forming an internal compartment, electronic circuitry within the internal compartment and surrounded by the cover, and a mesh of conductive traces provided on the cover and in communication with the electronic circuitry. The cover has an upper wall and interconnected side walls depending downwardly from the upper wall. The lower surface of the upper wall which faces the internal compartment has its entire surface area which is formed of at least one three-dimensional shape which extends outwardly from an x-y plane in the z-direction.

In one example, an electronic device housing may include a substrate, an insulating adhesive layer formed on a surface of the substrate, a patterned electroless plating layer formed on the insulating adhesive layer, and a patterned electrolytic plating layer formed on the patterned electroless plating layer.