The electrical equipment battery includes: a circuit board mounted with a heat generating element; and an outer case having a heat radiation plate made of metal. A heat transfer space is defined between the circuit board and the heat radiation plate, and then an electrical-insulating and heat-conducting gel is filled in the heat transfer space. Heat energy of the heat generating element is radiated to the outside via the heat radiation plate of the outer case. The heat radiation plate is provided with a flow-out block partition on the outer side of the heat transfer space. The flow-out block partition suppresses the electrical-insulating and heat-conducting gel from flowing out from the heat transfer space.

Provided is an electronic device. The electronic device includes a cover allowing an external signal to pass therethrough, a circuit board provided on one side of the cover and having a first opening allowing the external signal to pass therethrough, and a sensing unit provided on one side of the circuit board and having a sensor part provided at a position corresponding to the first opening to receive the external signal. An electronic device according to the present invention may be associated with an artificial intelligence module, robot, augmented reality (AR) device, virtual reality (VR) device, and device related to 5G services.

An object of the invention is to provide an electronic control unit having a structure that suppresses corrosion of plating and completely seals the substrate side under an environment where corrosion occurs. An electronic control unit 1 includes a printed wiring board 10 in which electronic components are provided, a case 20 in which the printed wiring board 10 is accommodated, and a cover 22 that is provided on the case 20. The case 20 and the cover 22 have joint surfaces that face each other and are connected via a sealing material 28. The joint surface is provided with a screw 30 that passes through the cover 22 or the case 20. A plating 24 is provided in a surface of the case 20 or the cover 22 that is provided with a through hole through which the screw 30 penetrates. An exposed portion 25a of a base material formed by partially peeling off the plating 24 presents inside the case 20 or the cover 22 and on an inner side of the case 20 from the through hole. The sealing material 28 has penetrated into the exposed portion 25a of the base material.

An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.

Various aspects include audio devices with a capacitive sensing interface along a compound curved wall. Some aspects of the disclosure relate to wearable audio devices with a capacitive sensing interface and a flexible printed circuit board (PCB) for detecting a touch command at the interface. In certain cases, the flexible PCB has at least one slit for conforming to the compound curve of the wall. In additional implementations, the inner surface of the wall is faceted and the flexible PCB conforms to the facets in the wall.

The present invention relates to a power module and a method for manufacturing same, the power module including: a lower ceramic substrate; an upper ceramic substrate which is disposed spaced apart from the upper portion of the lower ceramic substrate, and on the lower surface of which a semiconductor chip is mounted; spacers each having one end bonded to the lower ceramic substrate and the other end bonded to the upper ceramic substrate; first bonding layers each bonding the one end of each spacer to the lower ceramic substrate; and second bonding layers each bonding the other end of each spacer to the upper ceramic substrate. The present invention maintains a constant distance between the lower ceramic substrate and the upper ceramic substrate by having the spacers arranged therebetween, and thus is advantageous in that the semiconductor chip can be protected and heat dissipation efficiency can be increased.

Disclosed is a portable communication device including a housing, a first printed circuit board (PCB) disposed in the housing, a wireless communication circuit mounted on the first PCB, and a second PCB including a connection part connected with the first PCB, a first PCB portion extended from the connection part and having greater flexibility than the connection part, a second PCB portion extended from the first PCB portion and having less flexibility than the first PCB portion, a third PCB portion extended from the second PCB portion and having greater flexibility than the second PCB portion, a fourth PCB portion extended from the third PCB portion and having less flexibility than the first PCB portion, a signal line extended to the connection part along the first, second, third, and fourth PCB portions, and vias arranged in at least a partial area of the second PCB portion or the fourth PCB portion, wherein a portion of the signal line is located between some of the vias.

An electronic device includes a housing including a front plate, a rear plate facing away from the front plate, and a side member surrounding a space between the front plate and the rear plate and connecting one side of the front plate to one side of the rear plate, an antenna structure including at least part of the conductive portion, and a printed circuit board disposed in the space and including at least one processor. At least part of the side member is a conductive portion. The conductive portion includes a first conductive pattern, a second conductive pattern disposed at least partially coupled to the first conductive pattern, and a third conductive pattern disposed at least partially coupled to the first conductive pattern and spaced apart from the second conductive pattern. The antenna structure includes a first feeding part electrically connected to a first location of the first conductive pattern, a second feeding part electrically connected to a second location of the first conductive pattern, wherein the second location is closer to the third conductive pattern than the first location, a first ground part electrically connected to a third location between the first location and the second location of the first conductive pattern, a second ground part electrically connected to a fourth location between the second location and the third location of the first conductive pattern, a switch electrically connected to a fifth location between the first location and the third location of the first conductive pattern, a third ground part electrically connected to a sixth location of the second conductive pattern, and a fourth ground part electrically connected to a seventh location of the third conductive pattern.

An information handling system may include a printed circuit board and a plurality of connectors each electrically and mechanically coupled to the printed circuit board, each connector of the plurality of connectors configured to receive a respective modular information handling resource in order to electrically couple, via electrically-conductive pins of such connector, the respective modular information handling resource to the printed circuit board. Each connector may include a body comprising electrically non-conductive material and including a receptacle formed therein for receiving a mating edge connector of the respective modular information handling resource, a bus bar comprising electrically conductive material, other than the electrically-conductive pins of such connector, disposed within or upon the body and extending through at least a portion of the body, and an electrical termination electrically coupled to the bus bar.

System and methods to enable integration of electronic components to form LED assembly with a high accuracy (0.1 mm or better) and high process capability (Cpk of 1.67 or higher) for realizing precision electro-mechanical device. The system and methods use through holes that connect a printed circuit board to a housing as fiducial marks and LED emitter center as a reference point for alignment in order to improve the efficacy and accuracy of assembling of the LED assembly. The through holes are drilled by using laser drilling or milling machine, Use of adhesive to anchor the LED component down prior to reflow process i.e. to avoid self alignment characteristic of component on solder paste during reflow process.