An interposer assembly comprising:an interposer configured to connect a first circuit substrate and a second circuit substrate disposed facing the first circuit substrate with each other; and a penetrating member that extends through the interposer from a position on one side of the interposer to a position on the other side of the interposer, wherein the penetrating member has at least one of thermal conductivity and electrical conductivity.

A substrate of an electronic device includes a first set of contact pads and a first set of contact pillars having a height greater than the first set of contact pads. Components are coupled to the first set of contact pads and the first set of contact pillars in traversing directions. The components coupled to the contact pillars are positioned above the components coupled to the first set of contact pads such that at least a first portion of a first side of the component coupled to the contact traces faces a first side of the components coupled to the contact pillars. Stacking passive components in this manner can allow for increased component density without increasing package size.

A passive component includes a body including a dummy portion and a device portion. The dummy portion and the device portion extend in a first direction and are arranged such that a longitudinal axis of the device portion is offset from a longitudinal axis of the body in a second direction perpendicular to the first direction. The passive component further includes first and second electrical contacts on at least one surface of the body.

An electronic component comprising a glass body containing a photosensitizer; a conductor as at least a part of an electric element, arranged on the glass body; a terminal electrode as a terminal of the electric element, arranged above an outer surface of the glass body, with the terminal electrode being electrically connected to the conductor; and an insulating film arranged above the outer surface of the glass body. The insulating film reflects or absorbs light in a photosensitive wavelength range of the photosensitizer contained in the glass body.

A surface mount transmission line capacitor can have excellent high frequency performance characteristics. The surface mount transmission line capacitor can include a monolithic substrate having a surface, a first electrode formed over the surface, a second electrode arranged over the first electrode, a dielectric layer arranged between the first electrode and second electrode, a first terminal layer exposed along the surface of the substrate and electrically connected with the first electrode, and a second terminal layer exposed along the surface of the substrate and electrically connected with the second electrode. The first terminal layer and the second terminal layer can be contained within a perimeter of the surface of the monolithic substrate.

The present disclosure relates to a surface-mounted heat sink and a power module using the same. The power module includes a circuit board, a magnetic element and at least one power device. The magnetic element is disposed at an upper side of the circuit board, the at least one power device is disposed on a surface of the circuit board and located between the magnetic element and a lower side of the circuit board. The surface-mounted heat sink is disposed on the surface of the circuit board and adjacent to the at least one power device. A top surface disposed on one side of the magnetic element and the surface of the circuit board form a limiting height, the surface-mounted heat sink has a first height formed between a sucked surface and a surface-mounted surface thereof, and the limiting height is greater than or equal to the first height.

An electronic device is disclosed. In one example, the electronic device includes a circuit board comprising a recess a package in the recess, a semiconductor die coupled to the first side of the package, and a bridge extending from the first side of the package to the circuit board wherein the bridge electrically couples the package to the circuit board.

A ceramic electronic component includes: a ceramic body including a pair of end surfaces, and a side surface connecting the pair of end surfaces and including a pair of end regions adjacent to the pair of end surfaces and an intermediate region located between the pair of end regions; and a pair of external electrodes including a pair of base layers that cover the pair of end surfaces and the pair of end regions of the side surface and include outer surfaces, a difference of a surface roughness Ra of the outer surfaces with respect to the intermediate region of the side surface being 40 nm or less, and a pair of plating layers covering the outer surfaces of the pair of base layers and including a pair of extending portions extending from the outer surfaces of the pair of base layers to the intermediate region of the side surface.

An interposer of a multilayer ceramic capacitor includes a first through-hole in which a first pass-through conductive portion is provided on an inside wall thereof. A first surface side of the first through-hole is filled with a first conductive joining material that recessed at a central portion thereof as the first through-hole is seen from a second surface toward a first surface. The interposer includes a second through-hole in which a second pass-through conductive portion is provided on an inside wall thereof. A first surface side of the second through-hole is filled with a second conductive joining material that is recessed at a central portion thereof as the second through-hole is seen from a second surface toward a first surface.

A power supply unit for an aerosol inhaler includes: a case; a power supply that discharges power to a load for generating an aerosol from an aerosol generation source; a discharging terminal that connects the load to the power supply; a charging terminal that connects the power supply to an external power supply and is separated from the discharging terminal; a temperature measuring unit that measures temperature of the power supply; and a control device that controls an effective value of a first charging current to a value smaller than an effective value of a second charging current. The first charging current is supplied to the power supply when a measurement value of the temperature measuring unit is equal to or higher than a first threshold and the second charging current is supplied to the power supply when the measurement value is lower than the first threshold.