A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least one pair of first electrical conductors. The magnetic core portion comprises at least one core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.

A light-emitting device includes an insulating base member having thermal conductivity of 10 W/m.Math.K or more; a light-emitting element that has a cathode electrode and an anode electrode and is provided on a front surface side of the base member; a capacitive element that is provided on the base member and supplies an electric current to the light-emitting element; and a reference potential wire that is provided on a rear surface side of the base member and is connected to an external reference potential. The reference potential wire is connected to the capacitive element and is insulated from the cathode electrode and the anode electrode.

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer , which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.

An electronic system comprising a substrate with a substrate conductor pattern including substrate pads; a semiconductor component with active circuitry, and component pads coupled to the active circuitry of the semiconductor component and connected to the substrate pads of the substrate; a power source interface for receiving power from a power source; and a power distribution network for distributing power from the power source interface to the active circuitry of the semiconductor component. The power distribution network includes a first capacitor realized by conductive structures comprised in the semiconductor component, the first capacitor being coupled to a first component pad and a second component pad of the semiconductor component; a second capacitor arranged between the substrate and the semiconductor component, the second capacitor being coupled to the first component pad and the second component pad of the component package; and a power grid portion of the substrate conductor pattern.

In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.

An electronic component includes an element body and external electrodes. The element body includes a dielectric and an internal electrode. Each of the external electrodes includes a base layer formed on multiple surfaces of the element body and an electrically-conducting material layer formed on the base layer, the base layer including a metal and co-material particles dispersed in the metal and being connected to the internal electrode. The co-material particles at an interface surface between the base layer and the electrically-conducting material layer have edges covered with the metal at the interface surface. The electrically-conducting material layer is in contact with the co-material particles at the interface surface and the metal covering the edges of the co-material particles at the interface surface.

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: .Math.m) to an elastic modulus (unit: GPa) at 100° C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100° C. of 100 GPa or less.

A power adapter includes a circuit board, an electromagnetic interference filter, a shielding element, a power factor correction (PFC) inductor, a transformer and heating elements. The circuit board has a front side and a back side corresponding to each other, and a first long side and a second long side parallel to each other. The front side of the circuit board is divided into a first region, a second region and a third region along an extending direction of the first long side. The electromagnetic interference filter is disposed in the first region and close to the first long side. The shielding element is disposed in the first region and close to the electromagnetic interference filter. The PFC inductor is disposed in the first region of the circuit board and close to the second long side. The PFC inductor has a first long axis. The transformer is disposed in the third region and close to the first long side. The transformer has a second long axis, and the first long axis is perpendicular to the second long axis. The heating elements are disposed at the back side of the circuit board.

A mounting structure of an electronic component includes a multilayer ceramic capacitor including lands on a board and spaced apart from each other, solder on the lands, and a component main body including external electrodes on both end portions of the component main body in a length direction, each of the pair of external electrodes being connected to a corresponding one of the pair of lands via the solder. When a separation direction of the lands is an X direction and a direction orthogonal or substantially orthogonal to the X direction is a Y direction, when a width dimension of the land along the Y direction is c, a dimension of each of the external electrodes in the X direction is e, and a gap between the land and the external electrode is Gap, 3.4<(c×e)/Gap<258.8 is satisfied.

A component is disclosed. In an embodiment a component includes a first region suitable for a feedthrough of at least one bus bar and a second region in which at least one discrete device is arranged, wherein the first region and the second region are separated from one another by a cooling region thermally decoupling the first region from the second region.