An electronic device is provided that includes a board equipped with a pair of differential transmission lines that each have an opening extending between two line terminals. Moreover, the device includes a capacitor module that includes a support and two capacitors that each have two capacitor terminals, respectively, connected to the two line terminals of one line of the pair of transmission lines. In addition, the support includes a separating region between the two capacitors that has at least one cavity disposed between the two capacitors.

The present invention is directed to a multilayer capacitor and a circuit board containing the multilayer capacitor. The capacitor includes a main body containing a set of alternating dielectric layers and internal electrode layers wherein the set contains a first internal electrode layer and a second internal electrode layer and each internal electrode layer includes a top edge, a bottom edge opposite the top edge, and two side edges extending between the top edge and the bottom edge that define a main body of the internal electrode layer. Each internal electrode layer contains at least one lead tab extending from the top edge of the main body of the internal electrode layer and at least one lead tab extending from the bottom edge of the main body of the internal electrode layer, wherein at least one lead tab extending from the top edge of the main body of the internal electrode layer and at least one lead tab extending from the bottom edge of the main body of the internal electrode layer include a lateral edge aligned with a side edge of the main body of the internal electrode layer. External terminals are electrically connected to the internal electrode layers wherein the external terminals are formed on a top surface of the capacitor, a bottom surface of the capacitor opposing the top surface of the capacitor, and extending along an end surface between the top surface and the bottom surface.

Electrical components may have plastic packages. Contacts may be formed on exterior surfaces of the plastic packages. A plastic package for an electrical component may have an elongated shape that extends along a longitudinal axis. A first groove may run parallel to the longitudinal axis on a lower surface of the plastic package. A second groove may run perpendicular to the first groove on an opposing upper surface of the plastic package. The electrical components may be coupled to fibers in a fabric such as a woven fabric. A first solder connection may be formed between the first groove and a first fiber such as a weft fiber. A second solder connection may be formed between the second groove and a second fiber such as a warp fiber.

A component built-in substrate includes a multilayer body and a substrate including a multilayer ceramic electronic component embedded therein. The multilayer ceramic electronic component includes a first connection portion that protrudes from the first external electrode, and a second connection portion that protrudes from the second external electrode. The substrate includes a core material. The multilayer ceramic electronic component including the first connection portion and the second connection portion includes a surface covered by the core material and embedded in the substrate. The first connection portion protrudes toward a surface of the substrate, and is not exposed at the surface of the substrate. The second connection portion protrudes toward the surface of the substrate, and is not exposed at the surface of the substrate.

A power supply unit for an aerosol inhaler includes: a power supply able to discharge power to a load for generating an aerosol from an aerosol source; a connector able to be electrically connected to an external power supply; a control device configured to control at least one of charging and discharging of the power supply or configured to be able to convert power which is input from the connector into charging power for the power supply; and a zener diode provided between the connector and the control device so as to be connected in parallel with the control device. A maximum value of zener voltage of the zener diode is lower than a maximum operation guarantee voltage of the control device.

Embodiments relate to the field of semiconductors, and provide a semiconductor device and a storage system. The semiconductor device includes a first printed circuit board and a capacitor structure positioned on the first printed circuit board. The first printed circuit board includes a plurality of memories arranged in sequence along a first direction, and each of the memories has a first power terminal and a first ground terminal. The capacitor structure includes a plurality of capacitors, and each of the capacitors has a second power terminal corresponding to the first power terminal and a second ground terminal corresponding to the first ground terminal, wherein the first power terminal is electrically connected to the second power terminal, and the first ground terminal is electrically connected to the second ground terminal. The semiconductor device can at least solve a problem of capacitor arrangement space, which is advantageous to optimizing power quality.

A package substrate according to an embodiment includes an insulating layer; a first outer circuit pattern disposed on an upper surface of the insulating layer; a second outer circuit pattern disposed under a lower surface of the insulating layer; a first connection portion disposed on an upper surface of a first-first circuit pattern of the first outer circuit pattern; a first contact portion disposed on the first connection portion; a first device disposed on the first connection portion through the first contact portion; a second contact portion disposed under a lower surface of a second-first circuit pattern of the second outer circuit pattern; a second device attached to the second-first circuit pattern through the second contact portion; and a second connection portion disposed under a lower surface of a second-second circuit pattern of the second outer circuit pattern; wherein the first connection portion is disposed with a first width and a first interval, and wherein the second connection portion is disposed with a second width greater than the first width and a second interval greater than the first interval.

According to one embodiment, a capacitor includes a conductive substrate, a conductive layer, a dielectric layer, and first and second external electrodes. The conductive substrate has a first main surface provided with recess(s), a second main surface, and an end face extending between edges of the first and second main surfaces. The conductive layer covers the first main surface and side walls and bottom surfaces of the recess(s). The dielectric layer is interposed between the conductive substrate and the conductive layer. The first external electrode includes a first electrode portion facing the end face and is electrically connected to the conductive layer. The second external electrode includes a second electrode portion facing the end face and is electrically connected to the conductive substrate.

A multilayer capacitor includes: a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked on each other having at least one dielectric layer interposed therebetween in a first direction; first and second external electrodes disposed on the body while being spaced apart from each other to be respectively connected to first internal electrode and second internal electrode; and first and second bumps respectively having one surfaces disposed on the first or second external electrode and including at least one hole positioned in the one surface or the other surface, wherein A.sub.V indicates a total area of the at least one hole, A.sub.B indicates an area of the one surface of the first or second bump, facing the first or second external electrode, and A.sub.V/A.sub.B is greater than 0.012 and less than 0.189.

The power conversion device includes: a housing; an electric wiring board stored in the housing; a first heat generating component provided on the one surface of the electric wiring board; a second heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is equal to or smaller than a protruding height of the first heat generating component, the second heat generating component being provided on the one surface of the electric wiring board; and a third heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is greater than the protruding height of the first heat generating component, the third heat generating component being provided on another surface of the electric wiring board.