A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit.

The present invention provides a heat dissipating structure with high heat dissipation performance while reducing the electric resistance. A heat dissipating structure includes: a heat sink having a base portion, and a plurality of heat dissipating fins provided upright on a first surface of the base portion; a first heat generating component provided on a side of the first surface of the base portion while being in contact with at least one heat dissipating fin of the plurality of heat dissipating fins; a circuit board joined to a second surface, opposite to the first face, of the base portion while being electrically connected to the first heat generating component; a second heat generating component provided on the circuit board, the second heat generating component generating a smaller amount of heat than the first heat generating component; and a connector electrically connecting the first heat generating component and the second heat generating component. The connector has a first outlet into which a first connecting terminal on a side of the first heat generating component is insertable, and a second outlet into which a second connecting terminal on a side of the second heat generating component is insertable.

A circuit board structure includes a multi-layer board and a ceramic resistor embedded in the multi-layer board. The ceramic resistor includes a ceramic sheet, a plurality of connecting pads spacedly arranged on the ceramic sheet, and a plurality of resistance layers arranged on the ceramic sheet. At least one of the resistance layers is arranged between and electrically connected to any two of the connecting pads for providing a resistance value. The number of the resistance values provided by the ceramic resistor is more than the number of the resistance layers. The multi-layer board has a plurality of contacts arranged apart from each other, and the contacts are respectively and electrically connected to the connecting pads.

An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.

An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper.

Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

An electronic device may include a mechanical structure that mechanically supports the electronic device. One or more traces may be formed on one or more surfaces of the mechanical structure. Other electrical components may also be mounted on the surface of the mechanical structure and may or may not be connected to one or more of the traces. Additionally, one or more passivation layers may be formed on one or more of the surfaces, traces, and/or other electrical components and one or more traces and/or other electrical components may be intermixed with such passivation layers. In this way, the mechanical structure may be operable to function as an electrical component of the electronic device.

Provided is a printed circuit board including: an insulating layer; electronic devices embedded in the insulating layer; and an adhesive layer for fixing the electronic devices.

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

A control board of a power conversion device, the control board includes a board main body, a plurality of drive circuits, a power source control circuit, an insulation region, a plurality of insulation transformers, and a connecting line that electrically connects the plurality of insulation transformers and the power source control circuit to each other, and at least a part of which extends in a region in inner layers of the board main body that overlaps the insulation region when viewed in a perpendicular direction with respect to the surface of the board main body.