A device that includes a substrate including a plurality of metal layers, and a plurality of dielectric layers. The device further includes a first passive component including a first terminal, a second terminal, and a first body, mounted to the substrate on one of the plurality of metal layers. The first terminal is coupled to a first ground signal and the second terminal is coupled to a second ground signal such that the first passive component is shorted.

The present invention comprises: a base film on which a first element mounting part and a second element mounting part are defined; wiring patterns formed by extending from each of the first element mounting part and the second element mounting part on the base film, wherein the wiring patterns include a first terminal part in the first element mounting part and a second terminal part in the second element mounting part; and a first plating layer formed on the second terminal part, wherein the first plating layer includes a pure metal plating layer, and the first plating layer is not formed on the first terminal part.

A laminate having an integrated electrical component disposed within the laminate is disclosed. The laminate includes a first paper layer having at least first and second vias through the first paper layer; a first electrically-conductive layer, comprising an electrically-conductive material, disposed over a portion of the first paper layer; a second electrically-conductive layer, comprising the electrically-conductive material, disposed over another portion of the first paper layer; an electrical component disposed over the first and second electrically-conductive layers; and an insulating layer disposed over the electrical component. The first paper layer and the insulating layer encapsulate the first electrically-conductive layer, the second electrically-conductive layer, and the electrical component. The first and second vias are in electrical contact with the first electrically-conductive layer and a first terminal of the electrical component, and with the second electrically-conductive layer and a second terminal of the electrical component, respectively.

An electronic device includes a substrate, a plurality of conductive patterns, and a tunable element. A plurality of conductive patterns are disposed on the substrate. The tunable element is disposed on at least one conductive pattern in the plurality of conductive patterns and includes a first pad, a second pad, and a third pad. The first pad, the second pad, and the third pad are separated from each other. The first pad and the second pad are overlapped with the at least one conductive pattern in the plurality of conductive patterns. The third pad is disposed between the first pad and the second pad.

A cover member is provided on a resin plate to cover a flexible printed circuit board. The resin plate is provided with an opening at a position at which a thermistor element and a power storage cell are in contact with each other. The flexible printed circuit board has an extension piece portion extending to above the opening of the resin plate, and a root portion adjacent to the extension piece portion and wider than the extension piece portion. The thermistor element is disposed on the extension piece portion. The cover member has a protuberance that protrudes toward the resin plate side and that presses and bends the extension piece portion so as to press the thermistor element toward the power storage cell. The root portion is fixed to the resin plate.

A system for electrically connecting at least one light source to a system for supplying electrical power, wherein the connecting system comprises a lead frame able to be electrically connected to a system for supplying electrical power, the lead frame including at least one connecting terminal and at least one connecting means allowing the connecting terminal of the lead frame to be electrically connected to the light source, the connecting terminal and the connecting means being able to electrically connect the light source to the lead frame, thereby allowing the light source to be placed away from the lead frame.

A high-speed serial computer expansion bus circuit topology, comprises: a first signal path connecting between a first interface and a second interface, a second signal path connecting between the first interface and a third interface, a third signal path connecting between the third interface and a fourth interface, a first selector circuit having a first passive element and a second passive element which are respectively disposed in the first signal path and the second signal path, a second selector circuit having a third passive element and a fourth passive element which are respectively disposed in the second signal path and the third signal path. The second signal path is conducted when the first passive element and the second passive element are conducted, the third signal path is conducted when the third passive element and the fourth passive element are conducted.

A power substrate (101) of the present invention includes a plurality of insulating substrates (106) arranged side by side along a plurality of current paths (P) extending in the same direction, a plurality of MOS transistors (108) mounted on one major surface of each of the plurality of insulating substrates (106) with a first conductive layer (107) and a first solder bonding layer (109) in between, and a heat dissipation member (110) in contact with other major surfaces of all of the insulating substrates with a second conductive layer (107) and a second solder bonding layer (109) in between, and each of the current paths (P) is formed by connecting one or more of the MOS transistors (108) mounted on one of the insulating substrates (106) with one or more of the MOS transistors (108) mounted on a different one of the insulating substrates (106) in series with each other.

A package substrate and a manufacturing method thereof are disclosed. The method includes: providing an inner substrate; processing an adhesive photosensitive material on a surface of a first side of the inner substrate to obtain an adhesive first insulating dielectric layer; mounting a component on the first insulating dielectric layer; and processing a photosensitive packaging material on the first side of the inner substrate to obtain a second insulating dielectric layer, where the second insulating dielectric layer covers the component.