An apparatus including a board, an inductor that is provided on the board, a guard ring that includes a first guard ring part provided to be adjacent to a circumference of the inductor and a second guard ring part provided to be adjacent to an outer side of the first guard ring part, in which one end of the second guard ring part is connected to one end of the first guard ring part, and a first power supply that is connected to another end of the first guard ring part and another end of the second guard ring part.

An inductor component includes first and second inductor wiring lines, a first vertical wiring line, a second vertical wiring line, and a third vertical wiring line, wherein the first vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the first inductor wiring line, respectively, and the third vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the second inductor wiring line, respectively.

Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

The present application provides a synchronous rectification assembly, a manufacturing method thereof and a power supply. The synchronous rectification assembly comprises a synchronous rectification board, a transformer and a main board; wherein the synchronous rectification board is disposed on the main board and is electrically connected to the main board, and the transformer is disposed on the synchronous rectification board and is electrically connected to the synchronous rectification board; the synchronous rectification board is provided with a conductive contact for being electrically connected to an external apparatus, and the synchronous rectification board is used for synchronously rectifying an output signal of the transformer and thereafter transmitting the output signal to the conductive contact. The present application can solve the problem that the output signal outputted by the transformer in the existing synchronous rectification assembly has a large loss during transmission.

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

A multi-piece wiring substrate includes a matrix substrate including first and second insulating layers, and interconnection substrate regions arranged in a matrix. The matrix substrate includes dividing grooves opposing each other and disposed along boundaries between the interconnection substrate regions, and through-holes penetrating the matrix substrate in a thickness direction at positions where the dividing grooves are disposed. The inner surface conductor gradually decreases in thickness from a thick portion in a middle of the inner surface conductor, to thin portions disposed on a side of a boundary between the first and second insulating layers and on a first main surface side, and includes inclination portions each of which gradually increases in thickness from a boundary between corresponding one of the dividing grooves and the inner surface conductor to an inner surface of the inner surface conductor, in vertical sectional view.

A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

A coil component includes: a core part including: a winding shaft; and a flange part provided on an axial-direction end of the winding shaft, which has an exterior face on the opposite side of the winding shaft, first and second side faces, and first and second groove parts provided on the exterior face and having a cut-out part on each the first and second side faces; a coil part including: a winding part of a conductor wound around the winding shaft; and two lead parts of the conductor led out from the winding part; and two terminal parts formed on the exterior face of the flange part; wherein the two lead parts are led in from the cut-out parts on the first and second side faces and fitted inside the groove parts, respectively, on the exterior face, and included in the pair of terminal parts, respectively.

A printed circuit board includes a first chip component, a second chip component, and a printed wiring board. The first chip component and the second chip component each has a length L2 in the longitudinal direction. A relationship of 0.894≤L2/L1≤1.120 is satisfied, where L1 represents a length of the first opening in the longitudinal direction. A relationship of 0.894≤L2/4≤1.120 is satisfied, where length L4 represents a length of the second opening in the longitudinal direction. A relationship of 0.183≤L.sub.OA/L.sub.iA≤50.309 is satisfied, where L.sub.iA represents a length of the first land in the longitudinal direction, and L.sub.OA represents a thickness of solder on an end surface of the first electrode. A relationship of 0.183≤L.sub.OB/L.sub.iB≤0.309 is satisfied, where L.sub.iB represents a length of the second land in the longitudinal direction, and L.sub.OB represents a thickness of solder on an end surface of the second electrode.

A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.