A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.

A package substrate is disclosed. The package substrate includes a substrate core, a cavity below the substrate core that extends from a surface of a first resist layer to a bottom surface of the package substrate, and a first terminal and a second terminal in the first resist layer. The package substrate also includes one or more passive components that are coupled inside the cavity to the first terminal and the second terminal.

The disclosure relates to a communication technique and system after 4G systems for combining a 5G communication system with IoT technology to support higher data rates. Based on 5G communication and IoT-related technologies, the disclosure can be applied to intelligent services (e.g., smart home, smart building, smart city, smart or connected car, healthcare, digital education, retail, security, and safety). A converter may include: a first printed circuit board having a first controller for power conversion disposed on an inner surface of the first printed circuit board, the inner surface of the first printed circuit board comprised in an inner surface of the converter; a second printed circuit board having a second controller for power conversion disposed on an inner surface of the second printed circuit board, the inner surface of the second printed circuit board facing the inner surface of the first printed circuit board and comprised in the inner surface of the converter; first connectors disposed on the inner surface of the first printed circuit board; and second connectors disposed on the inner surface of the second printed circuit board, the second connectors configured to be coupled with the first connectors.

A packaged electronic device includes a multilayer lead frame with first and second trace levels, a via level, an insulator, a conductive landing pad and a conductive crack arrest structure, the conductive landing pad has a straight profile that extends along a first direction along a side of the multilayer lead frame, the conductive crack arrest structure has a straight profile along the first direction and the conductive crack arrest structure is spaced from the conductive landing pad along an orthogonal second direction.

A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.

An inductor component includes cores, a coil disposed in the cores, and terminal electrodes. The coil includes first metal plates disposed on an upper surface of the cores, second metal plates disposed on a lower surface of the cores, and a plurality of metal pins each passing through one of the cores in a thickness direction. The coil has a helical shape by connecting the first metal plates to the second metal plates, with the plurality of metal pins therebetween. The terminal electrodes are spaced apart along a direction in which the helical shape extends, and are connected to the coil.

An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.

A first conductive pattern made from a conductive material is formed on a first surface that is one surface of a flexible film made from a dielectric material. An adhesive layer is disposed on a second surface opposite to the first surface of the flexible film. A pair of first outer electrodes generates an electric field in an in-plane direction of a composite member composed of the flexible film and the adhesive layer, and causes an electric current to flow through the first conductive pattern.

Described herein are apparatuses and methods for applying high voltage, sub-microsecond (e.g., nanosecond range) pulsed output to a biological material, e.g., tissues, cells, etc., using a high voltage (e.g., MOSFET) gate driver circuit having a high voltage isolation and a low inductance. In particular, described herein are multi-core pulse transformers comprising independent transformer cores arranged in parallel on opposite sides of a substrate. The transformer cores may have coaxial primary and secondary windings. Also describe are pulse generators including multi-core pulse transformers arranged in parallel (e.g., on opposite sides of a PCB) to reduce MOSFET driver gate inductance.