An embedded transformer module device includes an insulating substrate including a first side and a second side opposite to the first side and including a first cavity, a magnetic core in the first cavity, a primary winding wound horizontally around the magnetic core and having a spiral shape with more than one turn, and a secondary winding wound horizontally around the magnetic core, spaced away from the primary winding, and having a spiral shape with more than one turn.

A voltage regulator module includes a circuit board assembly, a magnetic core assembly and a molding compound layer. The circuit board assembly includes a printed circuit board and at least one switch element. The switch element is disposed on a first surface of the printed circuit board. Moreover, at least one first copper post, at least one second copper post, at least one third copper post and the magnetic core assembly are disposed on a second surface of the printed circuit board. The magnetic core assembly includes at least one opening. The at least one first copper post is penetrated through the corresponding opening, so that at least one inductor is defined by the at least one first copper post and the magnetic core assembly collaboratively. The molding compound layer encapsulates the printed circuit board and the magnetic core assembly in a double-sided molding manner.

In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.

Provided is a highly reliable power circuit device. The power circuit device includes a printed substrate, a power circuit, and a housing. The power circuit is formed on the printed substrate. The housing is connected with the printed substrate. The power circuit includes secondary-side switching elements, at least one smoothing choke coil, and smoothing capacitors. Portions of a smoothing choke coil core serving as a core of the smoothing choke coil are inserted in opening portions formed in the printed substrate. A winding of the smoothing choke coil is formed on the printed substrate. The smoothing choke coil is located between a region C in which the smoothing capacitors are arranged and regions A and B serving as a second region in which primary-side switching elements and the secondary-side switching elements serving as electric elements are arranged.

Apparatus for communicating across an isolation barrier. In one embodiment, the apparatus comprises a transformer having a first winding disposed on a first side of a printed circuit board (PCB) and coupled to a first local ground, and a second winding disposed on a second side of the PCB, the second side opposite to the first side, and coupled to a second local ground; a transmitter coupled to the first winding; and a receiver, coupled the second winding, that generates an output signal based on a signal received from the transmitter.

A multilayer substrate includes a multilayer body, an internal wire, land electrodes, and a ground electrode. The internal wire extends toward the land electrode from a position where the internal wire overlaps the land electrode when viewed from a first surface and is electrically connected to the land electrode by a via conductor. The internal wire is electrically connected to the ground electrode by a via conductor that is provided in a region from a position where a capacitor is located where the via conductor at least partially overlaps the land electrode when viewed from the first surface.

A circuit board assembly for electronic devices includes a circuit board having a first surface and a second surface opposite the first surface, and a heat sink carrier disposed on the first surface of the circuit board. The heat sink carrier includes at least one clamp portion. The assembly also includes a heat sink. The heat sink is positioned in the at least one clamp portion of the heat sink carrier to transfer heat from one or more electronic devices to the heat sink via the heat sink carrier.

An inductor includes a magnetic core, a first winding, a first electrically conductive standoff, and a second electrically conductive standoff. The magnetic core includes opposing first and second outer surfaces separated from each other in a first direction. The first winding has first and second ends, and the first winding is wound around at least a portion of the magnetic core. The first electrically conductive standoff is connected to the first end of the first winding, and the first electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface. The second electrically conductive standoff is connected to the second end of the first winding, and the second electrically conductive standoff extends along the magnetic core in the first direction from the first outer surface to the second outer surface.

A circuit assembly includes a first substrate including a first outer surface, a first capacitor disposed on the first outer surface, and a first metallic bar. The first capacitor has a first capacitor thickness in a first direction orthogonal to the first outer surface. The first metallic bar has a first bar thickness in the first direction, the first bar thickness being greater than the first capacitor thickness. An electrical load is optionally disposed on a second outer surface of the first substrate over the first metallic bar, in the first direction. The electrical load may be electrically coupled to the first metallic bar.

Apparatus and methods employing twisted differential compensation for routing high-speed signals near power delivery inductors. Traces used for a high-speed differential signal including a P trace and an N trace are routed through one or more layers in a multi-layer printed circuit board (PCB) substrate and employ a twisted portion proximate to the centerline of an inductor under which portions of the P and N traces are swapped horizontally in a layer parallel to the top plane and/or are swapped vertically by swapping layers. The signal paths are routed such that a level of noise inductively coupled into the P trace and the N trace from the inductor is approximately equally. Stripline structures may be used for signals that are routed under an inductor, while stripline and microstrip structures may be used for signals routed adjacent to an inductor.