A filter unit is provided to retrofit within signal lines that couple analog cockpit gauges to transducers in rotorcraft systems. The filter unit may include a housing assembly and an electromagnetic interference (EMI) filter assembly housed therein. The filter assembly may include a printed circuit board (PCB) having conductive PCB traces and a signal line input connector configured to connect to multiple transducer signal lines. The filter assembly may also include a signal line output connector configured to connect to multiple analog cockpit gauge signal lines and a plurality of common mode chokes electrically connected between the signal line input connector and the signal line output connector. Each common mode choke may be positioned on the PCB so that it does not electrically/magnetically interfere with the other common mode chokes of the plurality of common mode chokes.

A filter device includes: a multilayer board including a first dielectric layer, a first wiring layer including a reference electrode to which a reference potential is supplied, and a second dielectric layer positioned between the first dielectric layer and the first wiring layer and having a thickness different from a thickness of the first dielectric layer; a series passive element provided on a series wire electrically connecting a first terminal and a second terminal together; a first parallel wire electrically connecting the series wire and the reference electrode together; and a first parallel passive element provided on the first parallel wire. The first parallel wire includes: a first via penetrating through the first dielectric layer and electrically connected to the first parallel passive element; and a second via penetrating through the second dielectric layer and electrically connecting the first via and the reference electrode together.

A module type sensor includes a casing including a casing upper surface, a first casing side surface which is bent downward from the casing upper surface and has a lower end upwardly separated from a path through which a transmission line passes, and a second casing side surface which is bent downward from the casing upper surface and has a fixing bracket extending by being outwardly bent; a body unit fixedly installed inside the casing, formed of an insulator, supported by the printed circuit board at a lower end, and having, at a center, an opening which is open toward the transmission line; and a sensing substrate unit fixedly installed on an upper portion of the body unit, and including a voltage sensing circuit which is capacitively coupled to the transmission line exposed through the opening and a current sensing circuit which is inductively coupled to the transmission line.

A semiconductor device includes a first semiconductor chip in which a first multilayer wiring structure including a first coil and a second coil is formed and a second semiconductor chip in which a second multilayer wiring structure including a third coil and a fourth coil is formed. The second semiconductor chip is joined to the first semiconductor chip such that the first coil (second coil) and the third coil (fourth coil) are overlapped and the second semiconductor chip does not have an offset structure with respect to the first semiconductor chip. The second semiconductor chip is joined to the first semiconductor chip such that it is not overlapped with a pad for the first semiconductor chip and a pad for the second semiconductor chip.

A hand-held heating unit is disclosed having a turbine connected to a generator to generate electrical power from a compressed air source. The electrical power produced by the generator is suppled to a transformer to establish a voltage which is in turn used to energize a coil with an alternating current. The current causes a magnetic field to form in the coil that can be used to heat ferrous materials within the coil. A circuit board can control the current and frequency for different applications.

A power module comprises a first circuit board assembly and a magnetic core assembly. The first circuit board assembly comprises a first printed circuit board and at least two switch circuits disposed on the first printed circuit board. The magnetic core assembly is disposed near the first printed circuit board and comprises a magnetic core portion and at least one pair of first electrical conductors. The magnetic core portion comprises at least one core unit, the core unit comprises a pair of holes and a second magnetic overlapping region, and the pair of holes are separated by the second magnetic overlapping region. Each pair of the first electrical conductors is penetrated through the corresponding pair of holes of the magnetic core portion to define two output inductors. Each of the switch circuits is electrically connected with the corresponding output inductor to define a phase circuit of the power module.

Provided is a current detection device including a first stacked board; a second stacked board provided on a first region on the first stacked board; a third stacked board provided on a second region on the first stacked board; a magnetic measurement element provided in a third region on the first stacked board, the magnetic element provided between the first region and the second region; and a first coil provided on the magnetic measurement element or below the magnetic measurement element.

A power module and a carrier board are disclosed. The carrier board includes a circuit board body and a prefabricated substrate. The circuit board body includes a wiring layer. The prefabricated substrate is embedded in the circuit board body and includes an insulation layer and a metal layer, the metal layer is disposed on the insulation layer. The insulation layer is formed by a ceramic material. The metal layer is connected to the insulation layer through a sintering process. A surface of the insulation layer , which has contact with the at least one metal layer, has at least a part exposed outside of the at least one metal layer, the part of the insulation layer exposed to the outside of the at least one metal layer is an outer edge portion, and the outer edge portion is extended into the circuit board body along a horizontal direction.

Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and at least one external electrode provided on a planar mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the planar mounting face of the substrate body, and a concaved part which is inwardly concaved relative to the parallel face toward the substrate body and is located, as viewed in a direction perpendicular to the parallel face, inside the parallel surface so as to be surrounded by the parallel surface.