A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

A battery pack comprises a pair of physically separate battery cells share a single protection circuit module (PCM). Each further saw comprises a respective pair of electrodes, with both pairs of electrodes being connected to a single, common protection circuit board (PCB) of the PCM. The common PCM may be located in a spacing between adjacent ends of the batteries such that a widthwise dimension of the PCB has an upright orientation between the two batteries.

A physiological characteristic sensor assembly includes a flexible top housing including a needle port having a central opening, and a flexible lower housing defining a sensor bore through the lower housing, the sensor bore coaxial with the central opening of the needle port. The physiological characteristic sensor assembly also includes an electrical subsystem disposed between the top housing and the lower housing. The electrical subsystem includes a flexible printed circuit board having a sensor contact pad, a physiological characteristic sensor and an electrically conductive adhesive patch. The physiological characteristic sensor has a distal end that extends through the needle port and a proximal end that includes at least one electrical contact. The conductive adhesive patch electrically and physically couples the at least one electrical contact of the physiological characteristic sensor to the sensor contact pad of the flexible printed circuit board.

A system for measurement of an analyte level including an analyte sensor having an in vivo portion in contact with the interstitial fluid of a user and an ex vivo portion. The sensor further includes at least one working electrode and a reference electrode located on the in vivo portion, and a first substrate. The at least one working electrode and reference electrode sense signals associated with a measured analyte level in the interstitial fluid of a user. Further, the ex vivo portion includes a plurality of electronic components mounted thereon, and at least one of the electronic components are configured to receive the generated signals associated with the measured analyte level. The electronic components are mounted to the ex vivo portion using photonic soldering.

A biostimulator, such as a leadless cardiac pacemaker, having a flexible circuit assembly, is described. The flexible circuit assembly is contained within an electronics compartment between a battery, a housing, and a header assembly of the biostimulator. The flexible circuit assembly includes a flexible substrate that folds into a stacked configuration in which an electrical connector and an electronic component of the flexible circuit assembly are enfolded by the flexible substrate. An aperture is located in a fold region of the flexible substrate to allow a feedthrough pin of the header assembly to pass through the folded structure into electrical contact with the electrical connector. The electronic component can be a processor to control delivery of a pacing impulse through the feedthrough pin to a pacing tip. Other embodiments are also described and claimed.

Provided is an adhesion technology that can separate adherends with their recycling as a premise while meeting their reliability guarantee temperature conditions. A double-sided, pressure-sensitive adhesive tape includes a pair of pressure-sensitive adhesive layers and an electrically-conductive heat generating layer disposed between the paired pressure-sensitive adhesive layers. At least one of the paired pressure-sensitive adhesive layers contains a heat-foaming agent, and at least one of opposite end faces of the electrically-conductive heat generating layer extends out beyond a corresponding end face of the at least one pressure-sensitive adhesive layer.

A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.

A pre-charge unit for charging a DC link capacitor includes a printed circuit board including at least one conductive layer; a pre-charge switch on the printed circuit board; and a pre-charge resistor electrically connected in series with the pre-charge switch, wherein the pre-charge resistor is formed by a conductive trace in the at least one conductive layer of the printed circuit board.

The electrical equipment battery includes: a circuit board mounted with a heat generating element; and an outer case having a heat radiation plate made of metal. A heat transfer space is defined between the circuit board and the heat radiation plate, and then an electrical-insulating and heat-conducting gel is filled in the heat transfer space. Heat energy of the heat generating element is radiated to the outside via the heat radiation plate of the outer case. The heat radiation plate is provided with a flow-out block partition on the outer side of the heat transfer space. The flow-out block partition suppresses the electrical-insulating and heat-conducting gel from flowing out from the heat transfer space.

An energy storage module includes a plurality of energy storage devices electrically connected together in series; and a plurality of electronics boards distributed across the module, in electrical contact with one or more of the energy storage devices. The module further includes a plurality of flexible printed circuit boards whereby each of the plurality of electronics boards are electrically connected together in series with a neighboring one of the plurality of electronics boards by a different one of the flexible printed circuit boards. For each electronics board and for each flexible printed circuit board, a ground plane is provided, whereby the ground planes provide electrical grounding at substantially the same potential across all the electronics boards and all the flexible printed circuit boards.