Exemplary embodiments are directed to modular wiring interface boards for an actuator, the interface boards including a body, electrical terminals configured to receive a signal from a field control device, electrical contacts configured to be placed in electrical communication with a backplane electrically communicating with an actuator, switching mechanisms, and a processor. Each of the switching mechanisms is positionable in a first position and a second position. The processor reconfigures a wiring configuration of the plurality of electrical terminals to accommodate different field control devices based on the positions of the plurality of switching mechanisms. Modular wiring systems for an actuator and methods of operating an actuator are also provided.

A circuit structure includes an electronic component, a circuit board having a conductive path, the electronic component being mounted on the circuit board, a heat dissipation member on top of which the circuit board is placed and which dissipates heat of the circuit board, a sheet-like spacer sheet provided in a predetermined region between the circuit board and the heat dissipation member, and a bonding portion for bonding the circuit board and the heat dissipation member to each other, the bonding portion having adhesive properties or tackiness and being provided in a region between the circuit board and the heat dissipation member where the spacer sheet is not provided.

A power converter for a power system includes an input ceramic layer, an output ceramic layer, an input stage coupled to the input ceramic layer, an output stage coupled to the output ceramic layer, and a planar transformer coupled between said input stage and said output stage. The input receives a power input and the output stage generates a power output at least partially as a function of the power input. The planar transformer includes an input winding coupled to the input stage and an output winding coupled to the output stage. The input winding has a plurality of input turns and the output winding has a plurality of output turns. The input turns interleave the output turns.

The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.

The force sensing dome switch is configured to simultaneously, or nearly simultaneously, close or open two separate circuits. For one of these circuits, the force sensing dome switch acts as a variable resistor whose value is controlled by applied force. Each force sensing dome switch is disposed upon a printed circuit board (PCB) comprising two separate circuits. An example force sensing dome switch comprises: a conductive dome in conductive contact with a first trace of a first circuit, the conductive dome is configured to make conductive contact with a second trace of the first circuit when pressed down; and a force-sensing resistor element positioned between the PCB and the conductive dome, the force-sensing resistor element overlays a pair of interdigitated traces of a second circuit and is configured to conductively connect the pair of interdigitated traces when pressed against the PCB by the conductive dome. The force-sensing resistor element is a layer of material whose resistance changes when force is applied.

The power conversion device includes: a housing; an electric wiring board stored in the housing; a first heat generating component provided on the one surface of the electric wiring board; a second heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is equal to or smaller than a protruding height of the first heat generating component, the second heat generating component being provided on the one surface of the electric wiring board; and a third heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is greater than the protruding height of the first heat generating component, the third heat generating component being provided on another surface of the electric wiring board.

A compact solid state relay (7) is provided. Solid state devices (74, 75), such as Triacs or Thyristors are used to implement the relay functionality. The device is at least partially enclosed in a housing that has pins for mounting on an electronics board. A number of “U” shaped jumpers (72) or other jumpers or wires are provided in the housing to act as heat sinks. A subminiature fan (70) is positioned to create an air flow over the heat sinks and dissipate heat from the device.

There is provided a computer readable storage medium storing a program executable by a computer, and the program causes the computer to execute functions including: forming a first image in accordance with an electronic circuit diagram, in which a resistance value of a wiring portion is defined, to form the wiring portion by printing with a conductive ink; and correcting the first image in accordance with a second image, which is formed with a photothermal conversion material, when the first image is formed at least partially overlapping the second image, wherein the second image is an image for expanding a thermally expandable layer that thermally expands with heat and, when the image is irradiated with light, expanding the thermally expandable layer by converting the light into heat with the photothermal conversion material.

An electronic control unit includes a substrate, an electronic component, a heat sink, a cover, a heat accumulator, and a screw. A wiring pattern is formed on the substrate. The electronic component is mounted on the substrate and generates heat upon energization thereof. The heat sink is provided on one side of the substrate in its thickness direction. The cover is made of resin and is provided on the other side of the substrate in its thickness direction. The heat accumulator is fixed to a part of the cover on the substrate-side and is in contact with a surface of the substrate on the cover-side. One end of the screw is connected to the heat sink. A central portion of the screw is inserted through a hole passing through the substrate in its thickness direction. The other end of the screw is connected to the heat accumulator.