Patent classifications
H05K2201/1006
MULTI-POLE RF FILTERS
Multi-pole filters are provided herein. A multi-pole filter includes a substrate having a first resonator layer on a first side of the substrate and a second resonator layer that is electrically coupled to the first resonator layer and is on a second side of the substrate that is opposite the first side of the substrate.
Apparatus and methods for reducing unintended transport of data from power distribution systems using layered power filters
In some embodiments, a method includes receiving, at a circuit board, a power from a power supply. The method further includes filtering, at the circuit board and via a power filter having at least three choke filters, the power to produce a filtered power. The method further includes dividing, at a first portion of a circuit on the circuit board, a power associated with the filtered power into a first power and a second power, a characteristic of the first power differing from a characteristic of the second power by a factor of at least 1.5 or at most one half.
Apparatus and printed circuit board including PCB embedded filter having via group patterns
Various embodiments of the disclosure disclose a device including a main printed circuit board in which a band stop filter that interrupts at least some signals corresponding to a signal received from or transmitted to an antenna module is formed in via group patterns, and an antenna module connected to the main printed circuit board, and a printed circuit board. Various embodiments are possible.
Microelectronic package with substrate-integrated components
Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.
Electromagnetic interference (EMI) filter unit and associated methods
A filter unit is provided to retrofit within signal lines that couple analog cockpit gauges to transducers in rotorcraft systems. The filter unit may include a housing assembly and an electromagnetic interference (EMI) filter assembly housed therein. The filter assembly may include a printed circuit board (PCB) having conductive PCB traces and a signal line input connector configured to connect to multiple transducer signal lines. The filter assembly may also include a signal line output connector configured to connect to multiple analog cockpit gauge signal lines and a plurality of common mode chokes electrically connected between the signal line input connector and the signal line output connector. Each common mode choke may be positioned on the PCB so that it does not electrically/magnetically interfere with the other common mode chokes of the plurality of common mode chokes.
FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE
Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to ta second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.
ELECTRONIC COMPONENT
An electronic component includes an element body, an external electrode, and a resin film having electrical insulation properties. The element body includes a principal surface and a side surface adjacent to the principal surface. The external electrode includes a first electrode portion disposed on the principal surface and a second electrode portion disposed on the side surface. The resin film is disposed on the principal surface and is in contact with the principal surface. Each of the first electrode portion and the second electrode portion includes a conductive resin layer disposed on the element body. A conductive resin layer included in the first electrode portion is disposed on the resin film and is in contact with the resin film.
Wiring board, coupler module, and communication device
A wiring board includes couplers and external connection terminals including a first terminal group including a first antenna terminal and a first monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a first spacer terminal between the first antenna terminal and the first monitor terminal, and a second terminal group including a second antenna terminal and a second monitor terminal respectively connected to an output terminal and a coupler terminal of a coupler, and a second spacer terminal between the second antenna terminal and the second monitor terminal.
RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
A radio frequency module includes: a module board; a first electronic component and a second electronic component that are disposed apart from each other on the module board; and a third electronic component that is electrically connected to both the first electronic component and the second electronic component, and is disposed extending across the first electronic component and the second electronic component.
Lighting apparatus a pi-filter and non-isolated switch driving circuit and a base comprising a metal connector
A LED lighting apparatus has a circuit board and a base. The base is a hollow structure. The base with lateral wall has a conducting element. The circuit board is in the base and has a LED power driving circuit and a LED source. The LED power driving circuit has a full-bridge rectification. A π-filter circuit and a non-isolated switch driving circuit connected in order. An output terminal of the non-isolated switch driving circuit is connected with the LED source. The full-bridge rectification, the π-filter circuit and the non-isolated switch driving circuit are common grounded to form a power ground. The power ground is electronically connected with the conducting element in order to reduce the interference of an electromagnetic energy generated by the high-frequency switch signal to other appliances.