A filter element is mounted on a module substrate. The filter element includes a ground terminal and a pair of signal terminals. The module substrate includes a ground plane, a ground land, and an inductance adjusting line that connects the ground land to the ground plane. The ground terminal of the filter element is connected to the ground land of the module substrate. The inductance adjusting line includes an in-plane extending portion that extends in an in-plane direction of the module substrate.

A strip of linear lighting with distributed power conversion is disclosed. The linear lighting includes a flexible PCB. The flexible PCB is divided into repeating blocks, which are arranged electrically in parallel with one another between power and ground. Each repeating block includes power conversion and conditioning circuits. A plurality of LED light engines are connected to the outputs of the power conversion and conditioning circuits, electrically in series with one another. The power conversion and conditioning circuits typically include at least a full-bridge rectifier, and a filter may be connected to each of the LED light engines. A pair of conductors run the length of the PCB adjacent to it and are connected to each of the repeating blocks. A flexible, transparent covering surrounds the PCB and pair of conductors.

A radio-frequency module is provided that includes a structure, a filtering element disposed on the structure, a switching element embedded in the structure, and an impedance element connected to the switching element and the filtering element. In a plan view of the structure, the switching element and the filtering element overlap each other in at least part thereof. The structure has a plurality of vias including a via , a via and a via. The via connects the input-output terminal and the filtering element. The via connects the ground terminal and an impedance adjustment circuit including the switching element and the impedance element. In a plan view, the via is located in a smallest rectangular region encompassing the vias.

A filter module includes a circuit board on or in which a ground electrode is provided, and a low pass filter on the circuit board. The low pass filter includes first and second inductors, and a capacitor. The first and second inductors are cumulatively connected to each other. Relationships of Lp+Lg−M≥0 and Lp−M<0 are satisfied, where Lp denotes an inductance of a path between a connection portion between the first and second inductors and a ground terminal, Lg denotes an inductance of a path between the ground terminal and the ground electrode, and M denotes a mutual inductance between the first and second inductors.

A module includes a substrate, a component mounted on a top surface that is one principal surface of the substrate, a first shielding film provided on a top surface and a side surface of the component, a sealing resin provided on the top surface of the substrate and seals the component, and a second shielding film provided on a top surface of the sealing resin. A hole is provided on a top surface of the sealing resin, to reach at least a part of the first shielding film. The second shielding film disposed in the hole is brought into contact with the first shielding film at positions facing a top surface and a side surface of the component.

A high-frequency module includes: a module board that has main surfaces which are opposed to each other; a plurality of high-frequency components that are arranged on at least one of the main surfaces; a resin member that covers at least one of the main surfaces and has a plurality of side surfaces along an outer edge of the module board; and a shield electrode layer that covers some of the side surfaces without covering other side surfaces.

A high-frequency module includes a module substrate having main surfaces, one or more module components disposed on the main surface, a resin member covering the main surface, and a metal shield layer covering a top surface of each of the resin member and the one or more module components, and set to ground potential. A sub-module component, which is one of the one or more module components, has a sub-module substrate having main surfaces, a first circuit component disposed on the main surface, one or more second circuit components disposed on the main surface, a resin member covering the main surface, and a side surface shield layer covering a side surface of each of the resin member and the sub-module substrate, and set to the ground potential. An end surface on a top surface side of the side surface shield layer contacts the metal shield layer.

Disclosed herein is an electronic circuit module that includes a circuit board and a common mode filter mounted on the circuit board. The common mode filter includes first and second terminal electrodes constituting a first pair of terminal electrodes and third and fourth electrodes constituting a second pair of terminal electrodes. The circuit board includes: a first wiring layer having first, second, third, and fourth land patterns connected to the first, second, third, and fourth terminal electrodes, respectively, and first, second, third, and fourth wiring patterns connected to the first, second, third, and fourth land patterns, respectively; and a second wiring layer having a ground pattern that overlaps the first, second, third, and fourth wiring patterns without overlapping the first and second land patterns.

A filtered connector is mounted on a casing and includes a connection port and a filter board. An electrode plate mounted on one end of the connection port and electrically isolated from the casing is securely mounted through a through hole of the casing. The filter board has a circuit board assembly, multiple grounding spring plates and multiple filtering capacitors. The circuit board assembly has a slot to be mounted through by the electrode plate. The grounding spring plates are mounted on a surface of the circuit board assembly and electrically contact the casing. The filtering capacitors are electrically connected between the electrode plate and the grounding spring plates. As the filter board is not mounted inside the connection port, only the filter board is to be mounted without replacing the connection port, thereby lowering users' expense in installation of the filter board.

A module includes discontinuities, such as openings or slots, between regions of a conductive shield that correspond to circuits on a substrate. The discontinuities are provided to perturb current flow between the regions to reduce coupling between the circuits. The circuits may be transmit (TX) circuits and receive (RX) circuits, including acoustic filters on a printed circuit board.