An adaptive DC-DC boost converter arrangement and an electronic circuit including such an arrangement are provided. The arrangement includes a circuit board with a plurality of electronic components mounted thereon, implementing an adaptive DC-DC boost converter circuit and a boost decoupling capacitor. The adaptive DC-DC boost converter circuit comprises a DC-DC boost converter having a converter set value input, a boost supply input, and a boost voltage output, and an adaptive DC-DC boost control unit having a control input and a control output. An acoustical noise suppression filter is present having a filter input connected to the control output of the adaptive DC-DC boost control unit and a filter output connected to the converter set value input of the DC-DC boost converter.

A radio frequency module includes a module substrate having a main surface, a first circuit component arranged on the main surface, a resin member arranged on the main surface and covering a side surface of the first circuit component, a metal shield layer in contact with a top surface of the resin member and a top surface of the first circuit component, and an engraved portion provided on the top surface of the resin member. When the main surface is viewed in plan, the engraved portion does not overlap the first circuit component.

An electronic module includes a first semiconductor device disposed on a first main surface of an insulating board of a printed wiring board, a first capacitor disposed on a second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in a direction perpendicular to the first main surface, and a second capacitor disposed on the second main surface of the insulating board at a position that overlaps with the first semiconductor device when viewed in the direction perpendicular to the first main surface. A second electrode of the first capacitor is electrically connected to a ground pattern via a first ground via of the printed wiring board. A fourth electrode of the second capacitor is electrically connected to the ground pattern via a second ground via of the printed wiring board.

The high frequency module includes a mounting substrate, a circuit component, a resin layer, and a shield layer. The mounting substrate has a first main surface and a second main surface that face each other. The circuit component is mounted on the first main surface of the mounting substrate. The resin layer is disposed on the first main surface of the mounting substrate and covers at least part of an outer peripheral surface of the circuit component. The shield layer covers at least part of the resin layer and a main surface of the circuit component that is far from the mounting substrate. The high frequency module has a gap at at least one of a position between the circuit component and the resin layer, a position between the circuit component and the shield layer, a position inside the resin layer, and a position inside the shield layer.

To improve isolation among a plurality of electronic components. A radio frequency module includes a mounting substrate, a first electronic component and a second electronic component, a metal member, a first metal layer, a resin layer, and a second metal layer. The metal member is disposed between the first electronic component and the second electronic component on a first main surface of the mounting substrate. The first metal layer is disposed on the first main surface of the mounting substrate. The second metal layer covers at least a part of the resin layer. The first metal layer has a ground potential, and is in contact with the second metal layer. The metal member is in contact with the first metal layer and the second metal layer.

A radio frequency module includes a first switch, a second switch, a control circuit, a first filter, a second filter, a third filter, a fourth filter, and an antenna terminal. The first switch is capable of connecting a first selection terminal or a second selection terminal to a first common terminal in a selective manner. The second switch is capable of connecting a third selection terminal or a fourth selection terminal to a second common terminal in a selective manner. The first switch, the second switch, and the control circuit are provided in a single electronic component (a first electronic component). The control circuit is positioned between the first switch and the second switch in the electronic component.

The composite electronic component includes: a substrate having a GND pattern; a coil component having at least three terminals and mounted on a first surface of the substrate; and an overlapping arrangement component mounted on the first surface so that at least a part of the overlapping arrangement component overlaps the coil component when viewed from a first direction perpendicular to the first surface. The substrate has at least three coil connection patterns formed on the first surface and connected to the terminals, at least two component connection patterns formed on the first surface and connected to the overlapping arrangement component, and a GND via connecting one of the component connection patterns and the GND pattern to each other. The GND via is arranged in a substrate outer region, which is outside a region of a hypothetical polygon connecting all of the coil connection patterns on the substrate with a shortest perimeter, when viewed from the first direction.

A radio frequency module (1) includes a first switch (4), an attenuation filter (3), and a plurality of band pass filters (12A to 12C, 22A to 22C). The first switch (4) is a switch that is capable of simultaneously connecting a common terminal (40) to selection terminals (41, 42) out of a plurality of selection terminals (41 to 43). The plurality of band pass filters (12A to 12C, 22A to 22C) include a first band pass filter (22A) and a second band pass filter (22B). The attenuation filter (3) includes at least one reactive element out of an inductive element and a capacitive element. In the radio frequency module (1), the reactive element is adjacent to at least one band pass filter out of the plurality of band pass filters (12A to 12C, 22A to 22C).

A radio frequency module includes a mount board, an acoustic wave filter, a temperature sensor, and a correction circuit. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board. The acoustic wave filter is disposed on the first principal surface side of the mount board. The temperature sensor is disposed on the second principal surface side of the mount board. The correction circuit corrects a pass band of the acoustic wave filter in accordance with a temperature measured by the temperature sensor.

Embodiments may relate to a microelectronic package or a die thereof which includes a die, logic, or subsystem coupled with a face of the substrate. An inductor may be positioned in the substrate. Electromagnetic interference (EMI) shield elements may be positioned within the substrate and surrounding the inductor. Other embodiments may be described or claimed.