A method of manufacturing an electronic device includes preparing an electronic component including a first substrate on a main surface of which a functional unit and a first resin layer are formed. The first resin layer has a first surface facing the main surface of the first substrate, a second surface opposed to the first surface, a cavity on the first surface enclosing the functional unit, and a portion defining a wall of the cavity. The first resin layer defines a recess provided with a solder layer on the second surface. The method further includes preparing a second substrate having an electrode pad formed on a main surface, aligning the electronic component with the second substrate to layer the solder layer and the electrode pad in contact with the solder layer, and forming the electronic component and the second substrate into the electronic device.

An electronic component may include a substrate having a functional unit formed on a main surface of the substrate and a first resin layer formed on the main surface, the first resin layer having a first surface facing the main surface and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, and a solder layer being formed in the recess so as not to exceed the second surface in a thickness direction. The functional unit may include a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. The substrate may be formed of dielectric material.

Provided is a method for fabricating a strain-pressure complex sensor and a sensor fabricated thereby. This method includes coating a fabric with a graphene oxide; reducing the graphene oxide coated with the fabric to form a graphene; disposing carbon nanotubes on the fabric coated with the graphene; and connecting an electrode to the fabric.

An electronic device includes a first board, a second board, and support pillars. The support pillars hold the first board and the second board mutually separated. The first board has a first surface on which an electronic component is mounted. The first board has a second surface that includes depressed portions into which the support pillars extending from the second board are inserted.

A printed wiring board has a first conductive layer including a second electrode group bonded to a first electrode group of a flexible printed circuit board, and a second conductive layer, and a plane including the second conductive layer includes a first region including a reference region set in a bonded portion, a second region via a first boundary, and a third region via a second boundary, and a first boundary portion is positioned within a range of 0.5 times or more and 5 times or less a length of a short side of four sides in a prescribed direction, and a second boundary portion is positioned within a range of 0.5 times or more and 5 times or less the length of the short in a prescribed direction, and a density of the second conductive layer in the first region is higher than that in the second region.

A filter circuit includes: a first element that is a first capacitor or a first inductor connected in series between input and output terminals; a second element that is connected in parallel to the first element between the input and output terminals, is a second inductor when the first element is the first capacitor, and is a second capacitor when the first element is the first inductor; a third element that is connected in parallel to the first element and in series with the second element between the input and output terminals, is a third inductor when the first element is the first capacitor, and is a third capacitor when the first element is the first inductor; and an acoustic wave resonator having a first end coupled to a first node between the second element and the third element and a second end coupled to a ground terminal.

The disclosure relates to the technical field of quartz crystal oscillators, in particular to a direct temperature measurement oven controlled crystal oscillator. The direct temperature measurement oven controlled crystal oscillator according to the present disclosure does not require additional components for measuring the temperature of the wafer inside the crystal oscillator. Instead, the temperature measurement device is disposed on the surface of the wafer to directly measure the temperature of the wafer itself, In order to achieve the exact temperature of the wafer itself. The oven controlled crystal oscillator according to the present disclosure has a simple in structure and is easy to be manufactured. The temperature of the wafer itself is directly measured to make temperature measurement more accurate.

A piezoelectric vibration module includes a vibration plate adapted to have one end fixed and the other end not fixed and driven in a vertical direction based on the fixed first end, a first piezoelectric element attached to the top or bottom of the vibration plate and adapted to generate a vibration power when power is applied, and a weight formed in the other end of the top or bottom of the vibration plate and adapted to control the vibration frequency of the piezoelectric vibration module. The first piezoelectric element is attached to the top or bottom of the vibration plate with a predetermined interval from a fixed point at the one end of the vibration plate.

An electronic component includes: a first substrate; a second substrate that includes a functional element formed on a lower surface of the second substrate, the second substrate being mounted on the first substrate so that the functional element faces an upper surface of the first substrate across an air gap; and an insulating film that is located on the upper surface of the first substrate, overlaps with at least a part of the functional element in plan view, faces the functional element across the air gap, and has a film thickness that is more than half of a distance between a lower surface of the functional element and the upper surface of the first substrate.

A solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 25 mass % or less of Ag, and 1.3 to 6 mass % of In.