An electronic circuit board includes a substrate having a multilayer structure including a ground layer, has at least one configuration in which, in a ground layer closest to a signal terminal of an oscillator, a region overlapping a signal terminal in a plan view is a non-forming region of a ground electrode, in a ground layer closest to a first wiring connecting the signal terminal of the oscillator and an input portion of an amplifier, a region overlapping the first wiring in the plan view is a non-forming region of a ground electrode, and in a ground layer closest to a second wiring connecting the signal terminal of the oscillator and an output portion of the amplifier, a region overlapping the second wiring in the plan view is a non-forming region of a ground electrode.

An electronic device and oscillator structure are provided. The electronic device includes a printed circuit board, an oscillator configured to oscillate at a frequency corresponding to an operation clock of the electronic device, and a connection member disposed between the oscillator and the printed circuit board such that the oscillator is spaced apart from a surface of the printed circuit board to electrically connect the oscillator to the printed circuit board. The connection member includes a first pad part electrically connected to a terminal of the oscillator, a second pad part electrically connected to a pad of the printed circuit board, and at least one conductive pattern electrically connecting the first pad part and the second pad part.

An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.

An unmanned aerial vehicle (UAV) includes a transceiver control device, and a dipole antenna electrically coupled to the transceiver control device and configured to communicate with a ground control station under a control of the transceiver control device. The dipole antenna includes a printed circuit board (PCB), a first oscillator spirally wound around an outer side of the PCB, and a second oscillator. The first oscillator and the second oscillator form a half-wave dipole antenna.

A printed circuit assembly includes a printed circuit board, a processor, an oscillator and a noise reduction device. The printed circuit board has a ground connecting portion. The processor is disposed on the printed circuit board. The oscillator is disposed on the printed circuit board. The noise reduction device includes a wave absorber, a blocking sheet and an electrically conductive member. The wave absorber includes a processor covering part and an oscillator covering part. The oscillator covering part protrudes from one side of the processor covering part. The processor covering part and the oscillator covering part respectively cover the processor and the oscillator. The blocking sheet is stacked on the oscillator covering part to cover the oscillator. One end of the electrically conductive member is connected to the blocking sheet, and another end of the printed circuit board is connected to the ground connecting portion.

An oven controlled crystal oscillator consisting includes a substrate, which includes a substrate, at least one base, a crystal blank, a first cover lid, an IC chip, a heat-insulating adhesive, a heater, and a second cover lid. The top of the base is provided with a cavity, and the top of the base is connected to the substrate through conductive wires without using solder. The crystal blank is mounted in the cavity. The first cover lid seals the cavity. The IC chip is mounted on the bottom of the base. The base is mounted on the substrate through the IC chip and the heat-insulating adhesive, and the IC chip is mounted to the bottom of the base. Alternatively, the IC chip and the base are horizontally arranged. The second cover lid is mounted on the top of the substrate.

An oven controlled crystal oscillator consisting of heater-embedded ceramic package includes a substrate, a crystal package, a crystal blank, a metal lid, a first IC chip, and a cover lid. The crystal package is mounted on the substrate, and a central bottom of the crystal package is provided with the first IC chip. The crystal blank is mounted in the crystal package and sealed by the metal lid. The crystal package has an embedded heater layer establishing a symmetric thermal field with respect to the first IC chip and the crystal blank. Alternatively, a heater-embedded ceramic carrier substrate is arranged between the first IC chip and the crystal blank to establish a symmetric thermal field with respect to the first IC chip and the crystal blank. The cover lid is combined with the substrate to cover the crystal package and the metal lid.

A module comprises: a wiring board; a first component, a second component and a third component mounted on a first main surface; a shield structure mounted on the first main surface; a first sealing resin that seals the first component and the like; and a shield film that covers an upper surface of the first sealing resin and the like, the shield structure including a top side portion and at least one sidewall portion bent from the top side portion and thus extending therefrom, the top side portion including the top side portion's conductive layer and a magnetic layer therein, the sidewall portion including the sidewall portion's conductive layer therein, the top side portion's conductive layer and the sidewall portion's conductive layer being electrically connected to a ground conductor, the magnetic layer in the top side portion being located over the first component.

Close-contact layers that are capable of improving the degree of contact between electrodes and a ceramic insulating layer can be formed at low cost by firing a glass paste. When the electrodes, the ceramic insulating layer, and the close-contact layers are fired at the same time, the glass paste is sintered last, and thus, formation of voids, defects, and the like in portions of the ceramic insulating layer, on which the electrodes are disposed, as a result of shrinkage of the electrodes and the ceramic insulating layer at the time of firing being hindered by stress generated due to the difference in the degree of shrinkage can be suppressed. Therefore, the structure of the ceramic insulating layers in the above portions can be elaborated by the close-contact layers.

An electronic circuit board includes a substrate having a multilayer structure including a ground layer, has at least one configuration in which, in a ground layer closest to a signal terminal of an oscillator, a region overlapping a signal terminal in a plan view is a non-forming region of a ground electrode, in a ground layer closest to a first wiring connecting the signal terminal of the oscillator and an input portion of an amplifier, a region overlapping the first wiring in the plan view is a non-forming region of a ground electrode, and in a ground layer closest to a second wiring connecting the signal terminal of the oscillator and an output portion of the amplifier, a region overlapping the second wiring in the plan view is a non-forming region of a ground electrode.