An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally 02, N2O, NO2, H2, NH3, N2, SiF4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiOxHyCzFaNb. The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

An oscillator includes a circuit board including a supporting substrate (base member), a first VCXO (a first oscillator circuit), a second VCXO (a second oscillator circuit), and a ground terminal (terminal for ground). The first VCXO and the second VCXO are configured such that a second output frequency that is output from the second VCXO is higher than a first output frequency that is output from the first VCXO. The second VCXO is placed closer to the ground terminal than the first VCXO.

To provide a ceramic wiring board that may be thin, but have higher toughness, and have high connection strength to a wiring, an electronic device, and an electronic module. A ceramic wiring board (21) includes a ceramic sinter (211) containing an alumina crystal phase and a zirconia crystal phase as main components and containing manganese oxide and silica as auxiliary components, and a wiring (212) positioned in at least one of a surface or an inside of the ceramic sinter (211) and containing molybdenum as a main component. The zirconia crystal phase includes first crystal grains (211a) and second crystal grains (211b) having a larger grain size than the first crystal grains (211a), and the second crystal grains (211b) positioned at an interface between the ceramic sinter (211) and the wiring (212) include the second crystal grains entering a recess of the wiring (212).

The present disclosure discloses a crystal oscillator circuit on a PCB. The crystal oscillator circuit includes a crystal oscillator including an input end, an output end, a first grounding end and a second grounding end; a first capacitor with one end connected to the input end; and a second capacitor with one end connected to the output end, wherein the first grounding end is connected to a first grounding hole, the second grounding end is connected to a second grounding hole, the other end of the first capacitor is connected to a third grounding hole, the other end of the second capacitor is connected to a fourth grounding hole. The present disclosure further discloses the PCB and a server.

An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

An oscillator includes a power supply terminal, a ground terminal, a positive-side clock terminal, and a negative-side clock terminal. The power supply terminal is supplied with a high potential-side power supply voltage. The ground terminal is supplied with a low potential-side power supply voltage. The positive-side clock terminal outputs a positive-side clock signal of a differential clock signal. The negative-side clock terminal outputs a negative-side clock signal of the differential clock signal. The power supply terminal and the ground terminal are arranged side by side, and the positive-side clock terminal and the negative-side clock terminal are arranged side by side.

An electronic device may include a transceiver with a substrate and an inductor on the substrate. A ring of ground traces may surround the inductor. Circuit components may be patterned onto the substrate overlapping the inductor, a region of the substrate surrounded by the inductor, and/or a region of the substrate between the inductor and the ring. The components may be arranged in trees with feed lines extending radially outward from a central axis. The components in each tree may be separated from the capacitors in other trees by gaps, preventing eddy currents on the trees. The components may be used to form bypass capacitors for power supply lines, a low-dropout regulator load, part of the loop filter of a phase-locked loop, or other portions of the transceiver. The components may thereby be used to convey signals while also meeting fill factor requirements associated with fabrication of the substrate.

A copper base substrate of the present invention, in which a copper substrate, an insulating layer, and a circuit layer, are laminated in an order in the copper substrate, a ratio of a thickness (unit: m) to an elastic modulus (unit: GPa) at 100 C. is 50 or more in the insulating layer, and the circuit layer has an elastic modulus at 100 C. of 100 GPa or less.