The present disclosure discloses a flexible circuit board and a speaker. The flexible circuit includes a substrate, a first cover film attached to a side of the substrate and including at least a silica gel layer, a second cover film attached to the other side of the substrate, and a copper foil layer sealed between the substrate and the first cover film or between the substrate and the second cover film. Compared with the related art, the flexible circuit disclosed by the present disclosure has a higher strength.

Provided is a speaker, including: a frame, a first diaphragm and a flexible printed circuit board connected to the frame. The first diaphragm includes a first surface close to the flexible printed circuit board and arranged opposite to the flexible printed circuit board. The first surface is recessed along a direction departing from the flexible printed circuit board to form a glue slot. The first surface is connected to the flexible printed circuit board by glue to enable the glue to enter the glue slot. A thickness of the glue at a glue junction is increased to enhance strength of connection between the flexible printed circuit board and the first diaphragm to ensure reliability of mounting of the flexible printed circuit board on the first diaphragm, which may reduce a failure rate of the speaker.

A multi-piece wiring substrate includes a matrix substrate including first and second insulating layers, and interconnection substrate regions arranged in a matrix. The matrix substrate includes dividing grooves opposing each other and disposed along boundaries between the interconnection substrate regions, and through-holes penetrating the matrix substrate in a thickness direction at positions where the dividing grooves are disposed. The inner surface conductor gradually decreases in thickness from a thick portion in a middle of the inner surface conductor, to thin portions disposed on a side of a boundary between the first and second insulating layers and on a first main surface side, and includes inclination portions each of which gradually increases in thickness from a boundary between corresponding one of the dividing grooves and the inner surface conductor to an inner surface of the inner surface conductor, in vertical sectional view.

Disclosed is a speaker unit for an earphone. The speaker unit includes a frame, a magnet, a plate fixed to the frame and coming into contact with the magnet, a diaphragm, a coil disposed to be radially overlapped with the magnet and the plate, and a flexible printed circuit board (FPCB). Here, the FPCB includes a first area fixed to the diaphragm, a second area connected to the frame, and a plurality of third areas configured to connect the first area to the second area. The third area includes a contact point connected to the coil. The third areas each include at least one bent area, and a space is disposed between the third areas adjacent to each other.

An electronic device according to various embodiments of the disclosure may include a printed circuit board constructed with a layered structure of a plurality of boards, and may include, among the plurality of boards, a circuit board constructed around a first region to which an acoustic component is disposed, and having at least one slit constructed to block a low-frequency band noise.

The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.

The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

Disclosed is a flexible ultrasonic transducer in which a single layer serves dual function as both a matching layer and a flexible circuit for making electrical connections, and there is no separate matching layer. Also disclosed is a method of assembling the flexible transducer.

A circuit board has a flexible board with a principal surface, and a ground conductor provided in the flexible board. The flexible board is cut in at least one portion. The flexible board is bent using the cut portion, so that the flexible board has a first portion and a second portion at a different height from the first portion, and the ground conductor has a gap made by the cutting. At least one ground terminal is provided on the ground conductor near at least one end of the gap to electrically connect the circuit board to a ground provided in an external circuit.

The present invention provides a loudspeaker, which includes a frame, and a vibration system and a magnetic circuit system, the vibration system includes a membrane and a voice coil, the vibration system further includes a yoke, and a main magnet assembly and a side magnet assembly, the side magnet assembly is spaced apart from the main magnet assembly to form a magnetic gap, and an end of the voice coil away from the membrane is suspended in the magnetic gap. The side magnet assembly includes a side magnet, and a first pole plate, the first pole plate is spaced apart from the membrane to form a spacing communicated with the magnetic gap, the loudspeaker further includes a leakage channel, one end of the leakage channel is communicated with the spacing, and another end of the leakage channel is communicated with an outside of the loudspeaker.