An electric machine includes a casing, a cap covering the casing to define an enclosure, a heat sink, a circuit board in the enclosure having a first conductive layer as a top face, a second conductive layer as a bottom face, and vias passing through the circuit board between the top and bottom faces. An electronic component is soldered to the circuit board on the first conductive layer and disposed on top of a first part of the vias. A conductive mass is soldered to the circuit board proximal to the electronic component and disposed on top of a second part of the vias. The conductive mass forms part of the circuit through which a power supply of the electric machine flows and is in electric and heat exchange relationship with the electronic component, while the bottom face is in heat exchange relationship with the heat sink.

A power module includes a insulation substrate, a first and a second input terminal supported by the insulation substrate, a plurality of arm circuits provided on the insulation substrate, and a plurality of output terminals corresponding to the plurality of arm circuits. The arm circuits each include a part of a wiring pattern formed on the insulation substrate, and a first switching element and a second switching element mutually connected in series via the part of the wiring pattern. The output terminals are each connected to a connection point between the first switching element and the second switching element in a corresponding one of the plurality of arm circuits. The plurality of arm circuits are located so as to overlap with a circle surrounding the first input terminal, as viewed in a thickness direction the insulation substrate.

According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.

A single circuit board assembly for forming a vehicle-motor interface includes a first side of a board with logic modules located thereon. The single circuit board assembly also includes a second side of the board with power modules located thereon. The board includes a first plurality of layers and a second plurality of layers, and a dielectric layer disposed between adjacent layers of the first plurality of layers and/or the second plurality of layers, the dielectric layer comprising polytronics material.

A motor driving circuit includes a wiring pattern formed in a circuit board, which is configured such that electrical current flowing into a motor flows through the wiring pattern; and a current measurement circuit configured to measure an amount of electrical current flowing through the wiring pattern, based on an amount of voltage drop occurring in response to flowing of the electrical current. The motor driving circuit includes a drive unit configured to adjust a current measurement value measured by the current measurement circuit, based on first adjustment data that compensates for variation in resistance of the wiring pattern caused by an individual difference in the circuit board, and to drive the motor based on an adjusted current value which is the adjusted current measurement value.

A water cooling radiator with a heat conducting plate of full-injection-molding closed heat radiation structure, including a surface cover, a motor, a main chamber provided with a motor mounting groove and a water cooling liquid inlet/outlet, an impeller arranged at the bottom of the main chamber, a turbine housing provided at the bottom of the impeller, and a heat radiation baseplate provided with an upper baseplate and a lower baseplate. A motor transmission seat is arranged in the motor mounting groove, and the bottom of the impeller is provided with fan blades. The bottom of the upper baseplate is provided with a throttling plate connected with the upper baseplate in a limiting contact manner through a throttling plate limiting groove, and the throttling plate is provided with a throttling plate through hole. The bottom of the lower baseplate is inlaid and connected with a metal bottom heat radiation plate insert.

According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical terminal and the third electrical terminal are electrically coupled to each other, the second electrical terminal and the fourth electrical terminal are electrically coupled to each other, and the first ground terminal and the second ground terminal are electrically coupled to each other.

A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.

A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. Connection terminal unit includes plurality of connection terminals facing and connected to plurality of terminal connection portions of semiconductor module, and terminal mold portion holding connection terminals. Terminal mold portion has abutment portion that abuts against semiconductor module or base material holding semiconductor module. Abutment portion has vertical abutment portion that abuts against semiconductor module or base material from vertical direction that is a direction in which connection terminals face terminal connection portions, and side abutment portion that abuts against semiconductor module or base material from at least two directions that are different from each other and intersect with vertical direction.

An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.