A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.

A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. Connection terminal unit includes plurality of connection terminals facing and connected to plurality of terminal connection portions of semiconductor module, and terminal mold portion holding connection terminals. Terminal mold portion has abutment portion that abuts against semiconductor module or base material holding semiconductor module. Abutment portion has vertical abutment portion that abuts against semiconductor module or base material from vertical direction that is a direction in which connection terminals face terminal connection portions, and side abutment portion that abuts against semiconductor module or base material from at least two directions that are different from each other and intersect with vertical direction.

A control substrate includes: a reverse connection protection circuit; a first substrate wiring connected with a source terminal of a MOSFET of the reverse connection protection circuit; a second substrate wiring connected with a GND terminal; a bypass circuit, allowing, in a case where an output voltage of a vehicle-mounted battery is equal to or greater than a predetermined value, a current to flow from the first substrate wiring to the second substrate wiring; and a clamp circuit, connected with a positive electrode terminal and a GND terminal on an upstream side with respect to the MOSFET and clamps a positive voltage to a second predetermined value. The first predetermined value is a value smaller than a withstand voltage between a gate and a source of the MOSFET.

A server box embodiment is disclosed that generally comprises an array of dummy HDDs that share a common set of universal disk drive components in a master components module, or power module. Each dummy HDDs is constructed without expensive onboard chipsets that control the normal functionality of a standard HDD. By sharing expensive chipsets in a master components module (power module) money can be saved in building and selling the dummy HDD server. Embodiments envision a power module possessing the needed chipset functionality that is missing in a dummy HDD. The power module can be made to move from dummy HDD to dummy HDD supplying the necessary chipset in a shared manner when data is being stored or retrieved for client or end-user.

The present invention is a fan having rotation sensing, comprising a casing, a motor disposed within the casing, a rotation sensing unit, and a control unit, the rotation sensing unit detecting a first rotation of the casing and outputting a first sensing signal, the control unit having a controller electrically coupled to the rotation sensing unit and the motor, the controller receiving the first sensing signal according thereto to control the motor to perform a first operation mode. Through this design, an operation mode of the fan can be adjusted according to the rotation of the fan in the present invention.

An electric power tool includes a driving unit generating a driving force by electricity and various components functioning by electricity, a circuit board on which a control unit configured to control the driving unit and the various components is mounted, a plurality of connectors connecting a plurality of wirings, which extend from the driving unit and the various components, with a plurality of wirings, which extend from the circuit board, a body portion installed therein with the driving unit, the various components, the circuit board and the plurality of connectors, and a receiving portion which receives the plurality of connectors therein and which is fixed to the body portion.

A detection device of the present invention is provided with: a housing; a circuit substrate disposed in the housing; a sensor which is electrically connected to the circuit substrate and detects information of an object to be measured; a connector terminal which is formed integrally with the circuit substrate and electrically connected to an external terminal; and a tubular connector which is formed integrally with the housing, surrounds a periphery of the connector terminal, and is fitted in the external connector. Through this configuration, the reduction in the number of components, the reduction in cost and weight, the simplification of structure, and other effects can be achieved.

An electronic assembly includes a PCB coupled to a mounting surface of a cooling jacket circumferentially mounted on a motor and a thermal management assembly (TMA) thermally connected to the PCB. One or more switching semiconductor devices are disposed on a first surface of the PCB proximate to the motor. The TMA includes the cooling jacket, at least one jacket manifold formed through the cooling jacket, a thermal compensation base layer thermally coupled to the cooling jacket and the one or more switching semiconductor devices, and a cooling manifold disposed through the PCB to form a fluid flow path. The at least one jacket manifold has a fluid inlet and a fluid outlet. Two or more electrically insulated posts, each having a cooling channel, are disposed between the at least one jacket manifold and the cooling manifold and form a fluid circuit between the fluid inlet and the fluid outlet.

A connector terminal (40) is formed by a connector joining portion (400) that is joined to a mating connector terminal, a connector bonding portion (40A) that is bent from the connector joining portion (40C) and extends along a surface of a board (31) and a movement stopper portion (40P-C) that engages with a movement stopper part (31E) provided at the board (31) and stops the connector bonding portion (40A) from moving on the surface of the board (31). In a state in which the connector bonding portion (40A) is put on solder applied to the board (31), the movement stopper portion (40P-C) engages with the movement stopper part (31E) of the board (31), and the connector terminal (40) is bonded and fixed to the board (31) with melted solder.

A printed wiring board used to suppress parasitic component is provided. The printed wiring board 100 includes a multi-layer substrate 110, and a power line 50 laid on the multi-layer substrate 110 and connected with a power terminal row T11a-T11d of a semiconductor device 10. The power line 50 includes a first wiring pattern 51 formed on a surface of the multi-layer substrate 110, a second wiring pattern 52 formed within the multi-layer substrate 110, and interlayer connections 53x and 53y electrically conducting the first wiring pattern 51 and the second wiring pattern 52 to bypass at least a portion of the power terminal row T11a-T11d.