An electronic device is disclosed. The electronic device may comprise: a housing having a first dielectric constant and including a first part; a substrate disposed inside the housing and including a communication module disposed on the surface thereof opposite to the first part; and a ceramic layer formed between the substrate and the first part to cover the communication module, wherein the first part and the ceramic layer are formed to have a second dielectric constant different from the first dielectric constant. Various other embodiments understood through the specification are possible.

A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.

RFID devices comprising (i) a transponder chip module (TCM, 1410) having an RFIC chip (IC) and a module antenna (MA), and (ii) a coupling frame (CF) having an electrical discontinuity comprising a slit (S) or non-conductive stripe (NCS). The coupling frame may be disposed closely adjacent the transponder chip module so that the slit overlaps the module antenna. The RFID device may be a payment object such as a jewelry item having a metal component modified with a slit (S) to function as a coupling frame. The coupling frame may be moved (such as rotated) to position the slit to selectively overlap the module antennas (MA) of one or more transponder chip modules (TCM-1, TCM-2) disposed in the payment object, thereby selectively enhancing (including enabling) contactless communication between a given transponder chip module in the payment object and another RFID device such as an external contactless reader. The coupling frame may be tubular. A card body construction for a metal smart card is disclosed.

The disclosure relates to a power supply module. The power supply module may include a flexible substrate and a plurality of battery cells distributed in an array on one side of the flexible substrate. Adjacent battery cells of the plurality of battery cells on each line in a first direction may be connected in series by a flexible connector to form a plurality of lines of battery cells, and the plurality of lines of battery cells may be connected in parallel through a first electrode.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a first protruding electrode disposed on the first surface; a first resin film covering the first component along a shape of the first component, covering at least a part of the first surface, and partially covering the first protruding electrode; and a first shield film formed to overlap with the first resin film. The first protruding electrode includes a first sharpened portion, the first protruding electrode is exposed from the first resin film in at least a part of the first sharpened portion, and the first shield film is electrically connected to the first protruding electrode by covering a portion where the first protruding electrode is exposed from the first resin film.

A module includes: a substrate having a first surface; a first component mounted on the first surface; a resin film covering the first component along a shape of the first component and covering a part of the first surface; and one or more wires disposed to extend over the first component on a side of the resin film farther from the substrate.

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.

Provided are a display device and a manufacturing method thereof. The display device includes a display assembly, an antenna, and a feed circuit board. At least part of the antenna is disposed on the side of the light emission surface of the display assembly. The antenna includes a radiator and a first feed structure connected to the radiator. The feed circuit board is disposed on the side of the display assembly facing away from the light emission surface. The feed circuit board includes a power division network and a second feed structure connected to the power division network. The first feed structure at least partially overlaps the second feed structure along the thickness direction of the display assembly.

A bicycle wireless control device has a support body that attaches to a bicycle. The support body houses a plurality of electric-electronic devices including a wireless communication module on a printed circuit board (PCB). A coaxial cable extends from the PCB to an outer surface of the support body and functions as an antenna.

A flexible circuit board for transmitting a signal in a frequency band includes an intermediate region in which a signal line is disposed as a transmission line for transmitting the signal in the frequency band, and a pad region extending from the intermediate region and disposed at one end or both ends of the flexible circuit board, a pad electrically connected to the signal line and formed to face a first direction of the flexible circuit board, and a ground pattern overlapping at least a portion of the pad and formed to face a second direction of the flexible circuit board and disposed in the pad region where the second direction is opposite to the first direction.