The present disclosure relates to an electronic device, and the electronic device may include a circuit board provided within a main body of the electronic device, on which a conductive layer made of a conductive material and a dielectric layer made of an insulating material are alternately laminated; at least one or more patch antennas disposed on the circuit board; a core layer located at a central portion inside the circuit board, and configured with any one of the dielectric layers; a ground layer disposed below the core layer; and an EBG structure located inside the circuit board in a symmetrical shape at the top and bottom with respect to the core layer, and the EBG structure restricts operating frequency signals radiated from the respective patch antennas from being interfered with each other.

An antenna module, comprising: a first antenna device, which is an AiM (Antenna in Module) and comprises at least one first antenna; a first FPC (flexible printed circuit), coupled to an outer surface of the first antenna device via a conductive structure; and at least one second antenna device, coupled to the first FPC, comprising at least one second antenna. By this way, an antenna module which can change directions of antennas via simplified structures is provided. Further, an antenna system applying the antenna module is also provided.

A flexible circuit board includes liquid crystal polymer (LCP) layers and metal layers including circuit routes. Each of the LCP layers includes via structures. The metal layers and the LCP layers are alternatively stacked to form a multi-layer structure. Adjacent metal layers are electrically connected through the via structures. Some via structures of different LCP layers are substantially aligned with one another to form a stack of via structures. Each of the via structures includes openings filled with conductive material. The size of the opening fulfils the following equation: Vb≥cos(Bh/Vh)*Vt/k*2, where Vb is a diameter of a smaller aperture, Vt is a diameter of a bigger aperture, Vh is a combined thickness of a LCP layer and a metal layer, Bh is a thickness of a LCP layer and k is a tensile modulus.

A condition monitoring device configured to be mounted on a machine for sensing, for example, vibrations produced by the machine during operation, includes a base, a printed circuit board assembly lying in a first plane, and first and second fasteners, each having a longitudinal axis, lying in a second plane perpendicular to the first plane, the first and second fasteners extending through the printed circuit board assembly and into the base. A third plane is perpendicular to the first and second planes and is located halfway between the longitudinal axes of the first and second fasteners. An integrated power supply is connected to the printed circuit board assembly, and at least two active sensing cells, such as vibration sensors, are arranged symmetrically relative to the second plane and/or symmetrically relative to the third plane.

An exemplary medical system includes a first electrical circuit on a printed circuit board (PCB) and configured to generate data, a second electrical circuit on the PCB and electrically isolated from the first electrical circuit, and a radio frequency (RF) communication interface assembly on the PCB. The RF communication interface assembly includes an RF transmitter electrically coupled to the first electrical circuit and electrically isolated from the second electrical circuit, an RF receiver out of direct RF signal path alignment with the RF transmitter, electrically coupled to the second electrical circuit, and electrically isolated from the first electrical circuit, and a waveguide between the RF transmitter and the RF receiver and configured to guide an RF signal representative of the data between the RF transmitter and the RF receiver.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

The present disclosure provides circuit structure configured to decrease a phase difference between a first signal and a second signal. The circuit structure includes substrate. The substrate includes a first conductive layer, a first woven dielectric layer, and a second woven dielectric layer. The first conductive layer is disposed over the substrate. The first conductive layer includes a circuit pattern configured to transmit the first signal and the second signal. The first woven dielectric layer is stacked below the first conductive layer. The first woven dielectric layer has a plurality of first opens. The second woven dielectric layer is stacked below the first woven dielectric layer. The second woven dielectric layer has a plurality of second opens. The plurality of first opens and the plurality of second opens are misaligned from a top view.

An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises: respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another, a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated, a cooling station for cooling the web after passage through the nip, and a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

Method and apparatus for producing RFID transponders (400) arranged on a carrying substrate, comprising:providing a first substrate (100), the first substrate having at least one antenna element (101) arranged thereon, and preferably several antenna elements arranged sequentially thereon along a longitudinal extension of the first substrate, each antenna element being formed by an electrically conductive pattern; providing a second substrate (200), the second substrate (200) having at least one RFID strap, each RFID strap comprising an IC (202) and at least one contact pad (201) coupled to the IC, and preferably several RFID straps being arranged sequentially along a longitudinal extension of the second substrate; and electrically connecting an antenna element (101) on the first substrate to the at least one contact pad on the second substrate by bringing said first and second substrates together, thereby bringing said antenna element in mechanical contact with said at least one contact pad, and heating the contact pad(s) to a temperature at least equal to a characteristic melting point of said at least contact pads, thereby electrically connecting the antenna element to said at least one contact pad.

A wireless communication device includes a base sheet in a folded state, a first conductor pattern disposed on a first principal surface of the base sheet, a second conductor pattern disposed on a second principal surface of the base sheet opposite to the first principal surface, an RFIC chip disposed on the base sheet so as to electrically connect to the first conductor pattern, and a sheet-shaped connection conductor coupled to a turning part of the base sheet so as to partially overlap with an end portion of the first conductor pattern near the turning part and an end portion of the second conductor pattern near the turning part.